DC Field | Value | Language |
---|---|---|
dc.contributor.author | Nah, JW | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-08-31T01:11:56Z | - |
dc.date.available | 2007-08-31T01:11:56Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2002-03 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.32 - 37 | - |
dc.identifier.issn | 1521-3331 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1196 | - |
dc.description.abstract | In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn-36Pb-2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-like Cu6Sn5 intermetallic compound (IMC) forms at the solder/E-Cu interface, and bump fracture occurred along this interface under a relatively small load. In contrast, at the E-Ni/E-Cu UBM, E-Ni serves as a good diffusion-barrier layer. The E-Ni effectively limited the growth of the IMC at the interface, and the polygonal-shape Ni3Sn4 IMC resulted in a relatively higher adhesion strength compared with the E-Cu UBM. As a result, electroless deposited UBM systems were successfully demonstrated as low cost IJBM alternatives on Cu pads. It was found that the E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on Cu pads than the E-Cu UBM. | - |
dc.description.sponsorship | This work was supported by the Center for Electronic Packaging Materials, Korea Science and Engineering Foundation. | en |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | SOLDER BUMP | - |
dc.title | Investigation of flip chip under bump metallization systems of Cu pads | - |
dc.type | Article | - |
dc.identifier.wosid | 000174515000004 | - |
dc.identifier.scopusid | 2-s2.0-0036505639 | - |
dc.type.rims | ART | - |
dc.citation.volume | 25 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 32 | - |
dc.citation.endingpage | 37 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Nah, JW | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | electroless copper | - |
dc.subject.keywordAuthor | electroless nickel | - |
dc.subject.keywordAuthor | intermetallic compound (IMC) | - |
dc.subject.keywordAuthor | shear strength | - |
dc.subject.keywordAuthor | solder bump | - |
dc.subject.keywordPlus | SOLDER BUMP | - |
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