Investigation of flip chip under bump metallization systems of Cu pads

In this study, UBM material systems for flip chip solder bumps on Cu pads were investigated using the electroless copper (E-Cu) and electroless nickel (E-Ni) plating methods; and the effects of the interfacial reaction between UBMs and Sn-36Pb-2Ag solders on the solder bump joint reliability were also investigated to optimize UBM materials for flip chip on Cu pads. For the E-Cu UBM, scallop-like Cu6Sn5 intermetallic compound (IMC) forms at the solder/E-Cu interface, and bump fracture occurred along this interface under a relatively small load. In contrast, at the E-Ni/E-Cu UBM, E-Ni serves as a good diffusion-barrier layer. The E-Ni effectively limited the growth of the IMC at the interface, and the polygonal-shape Ni3Sn4 IMC resulted in a relatively higher adhesion strength compared with the E-Cu UBM. As a result, electroless deposited UBM systems were successfully demonstrated as low cost IJBM alternatives on Cu pads. It was found that the E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on Cu pads than the E-Cu UBM.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2002-03
Language
ENG
Keywords

SOLDER BUMP

Citation

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.32 - 37

ISSN
1521-3331
URI
http://hdl.handle.net/10203/1196
Appears in Collection
MS-Journal Papers(저널논문)
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