DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, JS | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.contributor.author | Lim, JH | ko |
dc.contributor.author | Earmme, Youn-Young | ko |
dc.date.accessioned | 2007-08-31T01:08:28Z | - |
dc.date.available | 2007-08-31T01:08:28Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1999-06 | - |
dc.identifier.citation | APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509 | - |
dc.identifier.issn | 0003-6951 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1195 | - |
dc.description.abstract | As an increasing number of polymer dielectric layers were laminated, the maximum bow values were measured layer by layer using a laser profilometry during thermal cycling. In the lamination process, a polymeric film is overlaid on a silicon substrate using a polymeric adhesive. Since the lamination process uses relatively thick polymer films, the classical stress analyses assuming infinitesimally thin films, are no longer effective. In this letter, a simple model based on the composite beam theory is presented to analyze the experimental results, and compared with the well-known Stoney's formula. The thermomechanical behavior of the laminated multilayer polymer films on a silicon substrate was better described by the proposed model, while an error as much as 30% was involved using Stoney's formula. The model can be applied for the design and fabrication of multilayer multichip module substrates. (C) 1999 American Institute of Physics. [S0003-6951(99)03623-2]. | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | Amer Inst Physics | - |
dc.title | Thermomechanical stress analysis of laminated thick-film multilayer substrates | - |
dc.type | Article | - |
dc.identifier.wosid | 000080519000027 | - |
dc.identifier.scopusid | 2-s2.0-0042262083 | - |
dc.type.rims | ART | - |
dc.citation.volume | 74 | - |
dc.citation.issue | 23 | - |
dc.citation.beginningpage | 3507 | - |
dc.citation.endingpage | 3509 | - |
dc.citation.publicationname | APPLIED PHYSICS LETTERS | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.localauthor | Earmme, Youn-Young | - |
dc.contributor.nonIdAuthor | Kim, JS | - |
dc.contributor.nonIdAuthor | Lim, JH | - |
dc.type.journalArticle | Article | - |
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