DC Field | Value | Language |
---|---|---|
dc.contributor.author | Bae, S.-H. | ko |
dc.contributor.author | Kim, Y.-H. | ko |
dc.contributor.author | Kim, K. | ko |
dc.contributor.author | Lee, Hee Chul | ko |
dc.contributor.author | Kim, Choong Ki | ko |
dc.contributor.author | Shin, HC | ko |
dc.date.accessioned | 2013-03-15T10:11:02Z | - |
dc.date.available | 2013-03-15T10:11:02Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1997-04-20 | - |
dc.identifier.citation | Infrared Technology and Applications XXIII, pp.104 - 110 | - |
dc.identifier.uri | http://hdl.handle.net/10203/118529 | - |
dc.language | English | - |
dc.publisher | SPIE | - |
dc.title | Improvement in HgCdTe diode characteristics by flip-chip bonded annealing | - |
dc.type | Conference | - |
dc.identifier.wosid | A1997BJ64N00012 | - |
dc.identifier.scopusid | 2-s2.0-58149216397 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 104 | - |
dc.citation.endingpage | 110 | - |
dc.citation.publicationname | Infrared Technology and Applications XXIII | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Orlando, FL | - |
dc.contributor.localauthor | Lee, Hee Chul | - |
dc.contributor.localauthor | Shin, HC | - |
dc.contributor.nonIdAuthor | Bae, S.-H. | - |
dc.contributor.nonIdAuthor | Kim, Y.-H. | - |
dc.contributor.nonIdAuthor | Kim, K. | - |
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