Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist

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dc.contributor.authorYoon, Jun-Boko
dc.contributor.authorHan, Chul-Hiko
dc.contributor.authorYoon, Euisikko
dc.contributor.authorKim, Choong Kiko
dc.date.accessioned2013-03-15T07:46:51Z-
dc.date.available2013-03-15T07:46:51Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1998-09-21-
dc.identifier.citationProceedings of the 1998 Conference on Materials and Device Characterization in Micromachining, pp.316 - 325-
dc.identifier.urihttp://hdl.handle.net/10203/117538-
dc.languageEnglish-
dc.publisherSPIE-
dc.titleNovel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist-
dc.typeConference-
dc.identifier.wosid000076704600033-
dc.identifier.scopusid2-s2.0-0032302220-
dc.type.rimsCONF-
dc.citation.beginningpage316-
dc.citation.endingpage325-
dc.citation.publicationnameProceedings of the 1998 Conference on Materials and Device Characterization in Micromachining-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSanta Clara, CA, USA-
dc.contributor.localauthorYoon, Jun-Bo-
dc.contributor.localauthorHan, Chul-Hi-
dc.contributor.localauthorYoon, Euisik-
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EE-Conference Papers(학술회의논문)RIMS Conference Papers
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