DC Field | Value | Language |
---|---|---|
dc.contributor.author | We, Ju Hyung | ko |
dc.contributor.author | Lee, Heon Bok | ko |
dc.contributor.author | Gim, Sun Jin | ko |
dc.contributor.author | Kim, Gyung Soo | ko |
dc.contributor.author | Kim, Kukjoo | ko |
dc.contributor.author | Choi, Kyung Cheol | ko |
dc.contributor.author | Sul, Onejae | ko |
dc.contributor.author | Cho, Byung Jin | ko |
dc.date.accessioned | 2013-03-12T16:31:06Z | - |
dc.date.available | 2013-03-12T16:31:06Z | - |
dc.date.created | 2012-07-05 | - |
dc.date.created | 2012-07-05 | - |
dc.date.issued | 2012-06 | - |
dc.identifier.citation | JOURNAL OF ELECTRONIC MATERIALS, v.41, no.6, pp.1170 - 1176 | - |
dc.identifier.issn | 0361-5235 | - |
dc.identifier.uri | http://hdl.handle.net/10203/102875 | - |
dc.description.abstract | We propose a method that allows us to evaluate the thermal conductivity of a conductive material that has thickness on the order of microns. The key feature of the proposed method is use of a complete thermoelectric device with electrodes and a substrate, while conventional methods measure the temperature gradient of thermoelectric materials directly without electrodes. The measured thermal conductivity of a ZnSb film annealed at 380A degrees C in N-2 ambient for 16 min to 26 min is 1.2 W/m K to 1.4 W/m K. The measurement shows that thermoelectric film prepared by a screen-printing technique has lower thermal conductivity than bulk material (2.2 W/m K to 2.4 W/m K) because the screen-printing technique generates high porosity in the film. The lower measured thermal conductivity of the porous films compared with bulk material supports the reliability of the proposed measurement method. | - |
dc.language | English | - |
dc.publisher | SPRINGER | - |
dc.subject | THERMOELECTRIC PROPERTIES | - |
dc.subject | RHEOLOGY | - |
dc.title | Development of a Measurement Method for the Thermal Conductivity of a Thick Film Prepared by a Screen-Printing Technique | - |
dc.type | Article | - |
dc.identifier.wosid | 000304205100033 | - |
dc.identifier.scopusid | 2-s2.0-84862203199 | - |
dc.type.rims | ART | - |
dc.citation.volume | 41 | - |
dc.citation.issue | 6 | - |
dc.citation.beginningpage | 1170 | - |
dc.citation.endingpage | 1176 | - |
dc.citation.publicationname | JOURNAL OF ELECTRONIC MATERIALS | - |
dc.identifier.doi | 10.1007/s11664-011-1857-9 | - |
dc.contributor.localauthor | Choi, Kyung Cheol | - |
dc.contributor.localauthor | Cho, Byung Jin | - |
dc.contributor.nonIdAuthor | Lee, Heon Bok | - |
dc.contributor.nonIdAuthor | Kim, Gyung Soo | - |
dc.contributor.nonIdAuthor | Sul, Onejae | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Thermal conductivity | - |
dc.subject.keywordAuthor | thick film | - |
dc.subject.keywordAuthor | screen-printing technique | - |
dc.subject.keywordAuthor | ZnSb thermoelectric material | - |
dc.subject.keywordPlus | THERMOELECTRIC PROPERTIES | - |
dc.subject.keywordPlus | RHEOLOGY | - |
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