Development of a Measurement Method for the Thermal Conductivity of a Thick Film Prepared by a Screen-Printing Technique

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dc.contributor.authorWe, Ju Hyungko
dc.contributor.authorLee, Heon Bokko
dc.contributor.authorGim, Sun Jinko
dc.contributor.authorKim, Gyung Sooko
dc.contributor.authorKim, Kukjooko
dc.contributor.authorChoi, Kyung Cheolko
dc.contributor.authorSul, Onejaeko
dc.contributor.authorCho, Byung Jinko
dc.date.accessioned2013-03-12T16:31:06Z-
dc.date.available2013-03-12T16:31:06Z-
dc.date.created2012-07-05-
dc.date.created2012-07-05-
dc.date.issued2012-06-
dc.identifier.citationJOURNAL OF ELECTRONIC MATERIALS, v.41, no.6, pp.1170 - 1176-
dc.identifier.issn0361-5235-
dc.identifier.urihttp://hdl.handle.net/10203/102875-
dc.description.abstractWe propose a method that allows us to evaluate the thermal conductivity of a conductive material that has thickness on the order of microns. The key feature of the proposed method is use of a complete thermoelectric device with electrodes and a substrate, while conventional methods measure the temperature gradient of thermoelectric materials directly without electrodes. The measured thermal conductivity of a ZnSb film annealed at 380A degrees C in N-2 ambient for 16 min to 26 min is 1.2 W/m K to 1.4 W/m K. The measurement shows that thermoelectric film prepared by a screen-printing technique has lower thermal conductivity than bulk material (2.2 W/m K to 2.4 W/m K) because the screen-printing technique generates high porosity in the film. The lower measured thermal conductivity of the porous films compared with bulk material supports the reliability of the proposed measurement method.-
dc.languageEnglish-
dc.publisherSPRINGER-
dc.subjectTHERMOELECTRIC PROPERTIES-
dc.subjectRHEOLOGY-
dc.titleDevelopment of a Measurement Method for the Thermal Conductivity of a Thick Film Prepared by a Screen-Printing Technique-
dc.typeArticle-
dc.identifier.wosid000304205100033-
dc.identifier.scopusid2-s2.0-84862203199-
dc.type.rimsART-
dc.citation.volume41-
dc.citation.issue6-
dc.citation.beginningpage1170-
dc.citation.endingpage1176-
dc.citation.publicationnameJOURNAL OF ELECTRONIC MATERIALS-
dc.identifier.doi10.1007/s11664-011-1857-9-
dc.contributor.localauthorChoi, Kyung Cheol-
dc.contributor.localauthorCho, Byung Jin-
dc.contributor.nonIdAuthorLee, Heon Bok-
dc.contributor.nonIdAuthorKim, Gyung Soo-
dc.contributor.nonIdAuthorSul, Onejae-
dc.type.journalArticleArticle-
dc.subject.keywordAuthorThermal conductivity-
dc.subject.keywordAuthorthick film-
dc.subject.keywordAuthorscreen-printing technique-
dc.subject.keywordAuthorZnSb thermoelectric material-
dc.subject.keywordPlusTHERMOELECTRIC PROPERTIES-
dc.subject.keywordPlusRHEOLOGY-
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