Improvement of modulation bandwidth in electroabsorption-modulated laser by utilizing the resonance property in bonding wire

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dc.contributor.authorKwon, Oh-Keeko
dc.contributor.authorHan, Young-Takko
dc.contributor.authorBaek, Yong-Soonko
dc.contributor.authorChung, Yun-Churko
dc.date.accessioned2013-03-12T12:22:47Z-
dc.date.available2013-03-12T12:22:47Z-
dc.date.created2012-08-08-
dc.date.created2012-08-08-
dc.date.issued2012-05-
dc.identifier.citationOPTICS EXPRESS, v.20, no.11, pp.11806 - 11812-
dc.identifier.issn1094-4087-
dc.identifier.urihttp://hdl.handle.net/10203/102314-
dc.description.abstractWe present and demonstrate a simple and cost-effective technique for improving the modulation bandwidth of electroabsorption-modulated laser (EML). This technique utilizes the RF resonance caused by the EML chip (i.e., junction capacitance) and bonding wire (i.e, wire inductance). We analyze the effects of the lengths of the bonding wires on the frequency responses of EML by using an equivalent circuit model. To verify this analysis, we package a lumped EML chip on the sub-mount and measure its frequency responses. The results show that, by using the proposed technique, we can increase the modulation bandwidth of EML from similar to 16 GHz to similar to 28 GHz. (C) 2012 Optical Society of America-
dc.languageEnglish-
dc.publisherOPTICAL SOC AMER-
dc.subjectOPERATION-
dc.titleImprovement of modulation bandwidth in electroabsorption-modulated laser by utilizing the resonance property in bonding wire-
dc.typeArticle-
dc.identifier.wosid000304403100025-
dc.identifier.scopusid2-s2.0-84861496071-
dc.type.rimsART-
dc.citation.volume20-
dc.citation.issue11-
dc.citation.beginningpage11806-
dc.citation.endingpage11812-
dc.citation.publicationnameOPTICS EXPRESS-
dc.contributor.localauthorChung, Yun-Chur-
dc.contributor.nonIdAuthorHan, Young-Tak-
dc.contributor.nonIdAuthorBaek, Yong-Soon-
dc.description.isOpenAccessY-
dc.type.journalArticleArticle-
dc.subject.keywordPlusOPERATION-
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