Top Downloads for One Month

1 EVALUATION OF SEISMIC PERFORMANCE ON ECRD & CFRD USING NONLINEAR NUMERICAL SIMULATION View PDF (3383kb)

Kim, Dong-Sooresearcher; Cho, YK; Lee, JS
KNCOLD, 2014-10

740
2 Attacking Software-Defined Networks: A First Feasibility Study View PDF (211kb)

Shin, Seung Wonresearcher; Gu, Guofei
SIGCOMM, 2013-08-16

363
3 Instantaneous reference-free crack detection based on polarization characteristics of piezoelectric materials View PDF (2715kb)

Kim, SB; Sohn, Hoonresearcher
IOP PUBLISHING LTD, 2007-12

355
4 FRESCO: Modular Composable Security Services for Software-Defined Networks View PDF (797kb)

Porras, Phillip; Shin, Seung Wonresearcher; Yegneswara, Vinod; Fong, Martin; Gu, Guofei; Tyson, Mabry
NDSS, 2013-02-26

352
5 The effect of on-line consumer reviews on consumer purchasing intention: The moderating role of involvement View PDF (1515kb)

Park, Do-Hyung; Lee, Jumin; Han, Ingooresearcher
M E SHARPE INC, 2007

194
6 The effect of negative online consumer reviews on product attitude: An information processing view View PDF (225kb)

Lee, Jumin; Park, Do-Hyung; Han, Ingooresearcher
ELSEVIER SCIENCE BV, 2008-09

183
7 Security analysis of an ID-based key agreement for peer group communication View PDF (77kb)

Vo, DL; Kim, Kwangjoresearcher
IEICE-INST ELECTRONICS INFORMATION COMMUNICATIONS ENG, 2007-11

145
8 Frequency and temperature dependence of dielectric constant of epoxy/BaTiO3 composite Embedded Capacitor Films (ECFs) for organic substrate View PDF (1791kb)

Hyun, JG; Lee, S; Cho, SD; Paik, Kyung-Wookresearcher
IEEE, 2005-05-31

118
9 UBM (Under Bump Metallization) study for Pb-free electroplating bumping: Interface reaction and electromigration View PDF (2133kb)

Jang, SY; Wolf, J; Kwon, WS; Paik, Kyung-Wookresearcher
IEEE, 2002-05-28

118
10 Internet of Vehicles: From Intelligent Grid to Autonomous Cars and Vehicular Clouds View PDF (1322kb)

Gerla, Mario; Lee, Eun-Kyu; Pau, Giovanni; Lee, Uichinresearcher
IEEE, 2014-03-08

103
11 Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability View PDF (1154kb)

Jeon, YD; Paik, Kyung-Wookresearcher; Bok, KS; Choi, WS; Cho, CL
IEEE, 2001-05-29

95
12 A Wideband CMOS Low Noise Amplifier Employing Noise and IM2 Distortion Cancellation for a Digital TV Tuner View PDF (959kb)

Im, Dong-Gu; Nam, Il-Ku; Kim, Hong-Teuk; Lee, Kwy-Roresearcher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 2009-03

85
13 Development of Humanoid Robot Design Process - Focused on the concurrent engineering based humanoid robot design View PDF (1362kb)

Oh, Kwang-Myung; Kim, Ji-Hoon; Kim, Myung-Sukresearcher
International Design Congress, 2005

85
14 RNN을 이용한 한국어 문장 간 구문 유사도 측정 View PDF (126kb)

이동건; 오교중; 최호진researcher
한국정보과학회, 2016-07-01

84
15 Noncovalent functionalization of graphene with end-functional polymers View PDF (249kb)

Choi, Eun-Young; Han, Tae-Hee; Hong, Ji-Hyun; Kim, Ji-Eun; Lee, Sun-Hwa; Kim, Hyun-Wook; Kim, Sang-Oukresearcher
ROYAL SOC CHEMISTRY, 2010

83
16 Voltage oscillation reduction technique for phase-shift full-bridge converter View PDF (1852kb)

Park, Ki-Bum; Kim, Chong-Eun; Moon, GunWooresearcher; Youn, Myung Joongresearcher
IEEE, 2006-06-18

80
17 Adaptive Local Tone Mapping Based on Retinex for High Dynamic Range Images View PDF (1313kb)

Ahn, Hyunchan; Keum, Byungjik; Kim, Daehoon; Lee, Hwang Sooresearcher
IEEE Consumer Electronics Society, 2013-01-12

79
18 Application of Shaped Magnetic Field in Resonance (SMFIR) Technology to Future Urban Transportation View PDF (2831kb)

Suh, I. S.
CIRP, 2011

72
19 A Distinction between Business Groups and Conglomerates: The Limited Liability Effect View PDF (147kb)

Lee, Sunae; Seog, S. Hunresearcher
Korean Finance Association, 2008-05

71
20 Enhancement of dielectric constant in HfO2 thin films by the addition of Al2O3 View PDF (274kb)

Park, Pan Kwi; Kang, Sang-Wonresearcher
Amer Inst Physics, 2006-11

71

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