Browse by Type Conference
Showing results 821 to 840 of 109410
| 3D-DCNN 기반 얼굴 움직임의 시공간 은닉 특징 분석 김성태; 김대회; 노용만, 한국 멀티미디어학회 춘계학술 발표대회, 한국 멀티미디어학회, 2016-05-27 |
| 3D-Interconnected PVA-Citric Acid Porous Hydrogels Embedded with Potassium-Copper Hexacyanoferrate Nanoparticles for Enhanced Removal of Radionuclide Cesium Kim, Yun Kon; Kim, Yonghwan; Kim, Sungjun; Harbottle, David; Lee, Jae Woo, 2017 AICHE Annual Meeting, AICHE, 2017-11-01 |
| 3D-position estimation for hand gesture interface using a single camera Choi, S.-H.; Han, J.-H.; Kim, Jong-Hwan, 14th International Conference on Human-Computer Interaction, HCI International 2011, pp.231 - 237, HCI, 2011-07-09 |
| 3D-printed capacitive sensor for multidirectional force sensing 김규영; 김민성; 서지훈; 정용록; 박재호; 박인규, 마이크로 나노 시스템학회 (KMEMS) 2017, 마이크로나노시스템학회, 2017-03-31 |
| 3D-printed carbon-based conductive membrane electrodes for the electrochemical CO2 reduction 박혜주; 강석태, 한국공업화학회 2021 추계 총회 및 학술대회, 한국공업화학회, 2021-11-04 |
| 3D-printed Optogenetic Stimulator Integrated with a Recording Channel Oh, Keonghwan; Lim, Jihong; Lee, Hyunjoo Jenny; Ha, Sohmyung, 1st Annual IEEE BioSensors Conference, BioSensors 2023, Institute of Electrical and Electronics Engineers Inc., 2023-07-30 |
| 3D-stacked L2 Cache Configuration for DVFS-enabled Processor to Minimize Overall Energy Consumption Kyung, Chong-Min, International Conference on Convergence and Hybrid Information Technology(ICHIT), International Conference on Convergence and Hybrid Information Technology(ICHIT), 2010 |
| 3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs) Choi, Yongwon; Shin, Jiwon; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, ECTC, 2012-05 |
| 3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs) Paik, Kyung-Wook; Choi, Yongwon; Shin, Jiwon, 2013 Pan Pacific Microelectronics Symposium, 2013 Pan Pacific Microelectronics Symposium, 2013-01-23 |
| 3DeformR: Freehand 3D Model Editing in Virtual Environments Considering Head Movements on Mobile Headsets Lam, Kit Yung; Lee, Lik Hang; Hui, Pan, 13th ACM Multimedia Systems Conference, MMSys 2022, pp.52 - 61, Association for Computing Machinery, Inc, 2022-06 |
| 3DTV 방송 서비스를 위한 MPEG-2 와 HEVC 기반의 하이브리드 양안식 비디오 부호화 방법 나태영; 김문철; 김병선; 함상진; 이근식, 2012 한국방송공학회 하계학술대회, 한국방송공학회, 2012-07-05 |
| 3G and 3.5G wireless network performance measured from moving cars and high-speed trains Jang, Keon; Han, Mongnam; Cho, Soohyun; Ryu, Hyung-Keun; Lee, Jaehwa; Lee, Yeongseok; Moon, Sue Bok, 1st ACM Workshop on Mobile Internet Through Cellular Networks, MICNET'09, Co-located with the Mobile Computing and Networking Conference, MobiCom'09, pp.19 - 24, ACM Special Interest Group on Mobility of Systems, Users, Data and Computing (SIGMOBILE), 2009-09-21 |
| 3G-WLAN interworking: Security analysis and new authentication and key agreement based on EAP-AKA Mun, H.; Han, K.; Kim, Kwangjo, 2009 Wireless Telecommunications Symposium, WTS 2009, pp.309 - 316, IEEE, 2009-04-22 |
| 3G-WLAN 상호연동: EAP-AKA에 기반을 둔 새로운 인증 및 키 합의 프로토콜 문혜란; 한규석; 김광조, 한국정보보호학회 동계학술 대회 2008 CISC-W'08, pp.99 - 103, 한국정보보호학회, 2008-12-06 |
| 3G/LTE 네트워크의 새로운 위치 추적 보안 위협 홍병도; 홍현욱; 김홍일; 김용대, 2016 한국정보보호학회 동계학술대회, 한국정보보호학회, 2016-12-03 |
| 3GHz Through-Hole Signal Via Model Considering PowedGround Plane Resonance Coupling and Via Neck Effect Pak, Jun So; Kim, Joungho, Electronic Components and Technology Conference, pp.1017 - 1022, 2003-05-27 |
| 3GPP IMS (IP Multimedia Subsystem)에서 다양한 IP-CAN(Connectivity Access Network)이 존재할 때 최적 IP-CAN 선택을 위한 구조 및 알고리듬 Kim, Y; Lee, Hwang Soo, 한국통신학회 하계종합학술발표회, 2003-07 |
| 3GPP W-CDMA 시스템을 위한 스크램블링 코드 할당 방법 이용훈; 정영호, 통신정보합동학술대회 (JCCI 2001), pp.742 - 745, 2001-04 |
| 3GPP 공용패켓 채널에서 우선순위에 기반한 엑세스 방식 김휴대; 조동호; 이우용; 오행석, 한국통신학회 '99 추계종합학술대회, pp.244 - 247, 한국통신학회, 1999-11 |
| 3GPP 환경에서 QOS 보장을 위한 스케쥴링 이주민; 조동호; 이우용; 오행석, 한국통신학회 '99 추계종합학술대회, pp.227 - 230, 한국통신학회, 1999-11 |
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