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Showing results 82561 to 82580 of 99846

82561
Thermoelectric properties of nanocomposite thin films prepared with poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) and graphene

Kim, Gil-Ho; Hwang, Deok-Hyun; Woo, Seong-Ihl, PHYSICAL CHEMISTRY CHEMICAL PHYSICS, v.14, no.10, pp.3530 - 3536, 2012-01

82562
Thermoelectric properties of P-type Sb2Te3 thick film processed by a screen-printing technique and a subsequent annealing process

Kim, Sun Jin; We, Ju Hyung; Kim, Jin Sang; Kim, Gyung Soo; Cho, Byung Jin, JOURNAL OF ALLOYS AND COMPOUNDS, v.582, pp.177 - 180, 2014-01

82563
Thermoelectric properties of screen-printed ZnSb film

Lee, Heon Bok; We, Ju Hyung; Yang, Hyun Jeong; Kim, Kukjoo; Choi, Kyung Cheol; Cho, Byung Jin, THIN SOLID FILMS, v.519, no.16, pp.5441 - 5443, 2011-06

82564
Thermoelectric Sensor with CuI Supported on Rough Glass

Panama, Gustavo; Lee, Seung-Seob, NANOMATERIALS, v.14, no.1, 2024-01

82565
Thermoelectric Signal Enhancement by Reconciling the Spin Seebeck and Anomalous Nernst Effects in Ferromagnet/Non-magnet Multilayers

Lee, Kyeong-Dong; Kim, Dong-Jun; Lee, Hae Yeon; Kim, Seung-Hyun; Lee, Jong-Hyun; Lee, Kyung-Min; Jeong, Jong-Ryul; et al, SCIENTIFIC REPORTS, v.5, 2015-05

82566
Thermofluorescent Conjugated Polymer Sensors for Nano- and Microscale Temperature Monitoring

Yarimaga, Oktay; Lee, Su-Mi; Ham, Dae-Young; Choi, Ji-Min; Kwon, Soon-Gyu; Im, Mae-Soon; Kim, Sung-Ho; et al, MACROMOLECULAR CHEMISTRY AND PHYSICS, v.212, no.12, pp.1211 - 1220, 2011-06

82567
Thermography-based coating thickness estimation for steel structures using model-agnostic meta-learning

Lee, Jun; Hwang, Soonkyu; Kim, Kiyoung; Sohn, Hoon, SMART STRUCTURES AND SYSTEMS, v.32, no.2, pp.123 - 133, 2023-08

82568
Thermogravimetric Analysis of Copper Oxide for Chemical-Looping Hydrogen Generation

Son, Sung Real; Go, Kang Seok; Kim, Sang Done, INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, v.48, no.1, pp.380 - 387, 2009-01

82569
Thermomechanical analyses of laser precision joining for optoelectronic components

Chang, WS; Na, Suck-Joo, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.2, pp.349 - 358, 2003-06

82570
Thermomechanical behavior of alkali-activated slag/fly ash composites with PVA fibers exposed to elevated temperatures

Kim, J.S.; Lee, Haeng-Ki, ADVANCES IN CONCRETE CONSTRUCTION, v.11, no.1, pp.11 - 18, 2021-01

82571
Thermomechanical Behavior of Poly(3-hexylthiophene) Thin Films on the Water Surface

Ma, Boo Soo; Lee, Jin-Woo; Park, Hyeonjung; Kim, Bumjoon J.; Kim, Taek-Soo, ACS OMEGA, v.7, no.23, pp.19706 - 19713, 2022-06

82572
Thermomechanical Behaviors and Antiferroelectric Superstructures in Pb(Yb1/2Nb1/2)O3- Pb(Fe1/2Nb1/2)O3 Solution System

Choo, Woong Kil; H. Lim; K.S. Koh; J.R. Kwon, FERROELECTRICS, v.155, pp.249 - 254, 1994

82573
Thermomechanical Behaviors of Shape Memory Alloy Thin Films and Their Application

Roh Jin-Ho; Lee, In, KSAS INTERNATIONAL JOURNAL, v.7, no.1, pp.91 - 98, 2006-06

82574
Thermomechanical fatigue behavior of the ferritic stainless steel

Lee, KO; Hong, SG; Yoon, S; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, pp.1 - 4, 2005

82575
Thermomechanical Manipulation of Electric Transport in MoTe2

Kim, Dohyun; Lee, Jun-Ho; Kang, Kyungrok; Won, Dongyeun; Kwon, Min; Cho, Suyeon; Son, Young-Woo; et al, ADVANCED ELECTRONIC MATERIALS, v.7, no.4, 2021-04

82576
Thermomechanical properties and mechanical stresses of Ge2Sb2Te5 films in phase-change random access memory

Park, Il-Mok; Jung, Jung-Kyu; Ryu, Sang-Ouk; Choi, Kyu-Jeong; Yu, Byoung-Gon; Park, Young-Bae; Han, Seung Min J.; et al, THIN SOLID FILMS, v.517, no.2, pp.848 - 852, 2008-11

82577
Thermomechanical properties of chemically modified graphene/poly(methyl methacrylate) composites made by in situ polymerization

Potts, Jeffrey R.; Lee, Sun Hwa; Alam, Todd M.; An, Jinho; Stoller, Meryl D.; Piner, Richard D.; Ruoff, Rodney S., CARBON, v.49, no.8, pp.2615 - 2623, 2011-07

82578
Thermomechanical Reliability Study of Benzocyclobutene Film in Wafer-Level Chip-Size Package

Lee, K-O., JOURNAL OF ELECTRONIC MATERIALS, v.41, no.4, pp.706 - 711, 2012

82579
Thermomechanical stress analysis of laminated thick-film multilayer substrates

Kim, JS; Paik, Kyung-Wook; Lim, JH; Earmme, Youn-Young, APPLIED PHYSICS LETTERS, v.74, no.23, pp.3507 - 3509, 1999-06

82580
Thermomorphic Hydrophilicity Base-Induced Precipitation for Effective Descaling of Hypersaline Brines

Boo, Chanhee; Qi, Heyang; Billinge, Ian H.; Shah, Kinnari M.; Fan, Hanqing; Yip, Ngai Yin, ACS ES&T ENGINEERING, v.1, no.9, pp.1351 - 1359, 2021-09

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