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Showing results 85421 to 85440 of 109618

85421
Thermally Stable Photo-Curable Cyclo-aliphatic Epoxy hybrid Material for White LED Encapsulant

배병수; SeungCheol Yang; Seung-Yeon Kwak; Joon-Soo Kim, 2011년도 추계 고분자학회, 한국고분자학회, 2011-10

85422
Thermally stable polymeric waveguide using UV-curable epoxy resins for optical printedcircuit board

Kim, DW; Ahn, SH; Cho, IK; Im, DM; Shorab Muslim, SM; Park, HyoHoon, 11th International Conference on Advanced Communication Technology, ICACT 2009, v.2, pp.1430 - 1432, ICACT, 2009-02-15

85423
Thermally stable Sol-Gel derived siloxane hydrid material for light emitting diode (LED) encapsulation

Bae, Byeong-Soo; Bae, Junyoung; Kim, Yongho; Kim, Hwea-yoon, 2013 International Sol-Gel Conference, ISGS, 2013-08

85424
Thermally Stable Thin Film-based Disposable Cartridge for Plasmonic RPA and Cas12a

유은실; 강병훈; 정혜정; 권재명; 나하민; 정기훈, 2023년 한국바이오칩학회 춘계학술대회, (사)한국바이오칩학회, 2023-05-31

85425
Thermally stable transparent sol-gel siloxane hybrid materials for LED encapsulants

Bae, Byeong-Soo; Kim, J; Yang, S, The International Chemical Congress of Pacific Basin Societies, PACIFICHEM 2010, 2010-12

85426
Thermally Stable Vertical μLED Patch for Facilitating Hair Growth

LEE, JAEHEE; Lee, Keon Jae, 2022 MRS SPRING MEETING & EXHIBIT, Materials Research Society, 2022-05-11

85427
Thermally Stable Vertical μLED Patch for Facilitating Hair Growth by Light Stimulation

Lee, JaeHee; Lee, Keon Jae, The 22nd International Meeting on Information Display (IMID 2022), The Korean Information Display Society, 2022-08-26

85428
Thermally stable ZnF2/Al-doped ZnO double-layered transparent conducting oxide for dye-sensitized and perovskite solid state solar cells

이희상; 김수호; 우성일, 2015 KIChE Spring Meeting, KIChe, 2015-04

85429
Thermally Switchable One- and Two-Dimensional Arrays of SWNTs in a Polymeric System

Choi SungMin; Doe, Changwoo; Jang, Hyung-Sik; Kim, Tae-Hwan; Kline, Steven R., ChemOnTubes 2010, 2010-04

85430
Thermally Tunable Free-Standing Photonic Crystals Through Assembly of Soft Colloids

Park, Jin-Gyu; Rogers, W. Benjamin; Magkiriadou, Sofia; Kodger, Tom; Kim, Shin-Hyun; Kim, Young-Seok; Manoharan, Vinothan N., 2014 MRS Spring Meeting , Materials Research Society, 2014-04-22

85431
Thermally tunable microlenses using smetic liquid crystal defects

김정현; 정현수; 손백식; 정희태, 대한화학회 제107회 총회 및 학술발표회, 대한화학회, 2011-04-29

85432
Thermally-Activated Phase Slips in Superfluid Spin Transport in Magnetic Wires

Kim, Se Kwon, Spin Caloritronics 7, Utrecht University, 2016-07-14

85433
Thermally-driven convection of a compressible fluid in a rapidly rotating cylinder

Hyun, Jae Min; Park, J.K., Hemisphere Publ. Corp., pp.365 - 374, 1989

85434
Thermally-Responsive Softening Intravenous Needle for Enhancement of Patient Care and Healthcare Provider Safety

Agno, Karen-Christian; Yang, Keungmo; Byun, Sanghyuk; OH, SUBIN; Lee, Simok; Kim, Heesoo; Kim, kyurae; et al, 2023 MRS Spring Meeting & Exhibit, Materials Research Society, 2023-04-14

85435
Thermally-stabilized fiber-optic current sensors using perpendicular coil formers

Lee, ML; Lee, Yong-Hee, OECC'96 , pp.0 - 0, OECC, 1996-06-01

85436
Thermo- and photo-responsive polymersomes

Amstad, Esther; Kim, Shin-Hyun; Weitz, David A., 2013 MRS fall meeting, Materials Research Society, 2013-12-02

85437
Thermo-acoustic Instability in a Combustor with Branch Tube

Park, Jang Hee; Guahk, Young Tae; Shin, Hyun Dong, , JSME-KSME, 2008

85438
Thermo-Calc를 이용한 슈퍼 듀플렉스 스테인리스강의 상평형 계산

박상희; 박중근, 대한금속재료학회, 추계학술발표대회, v.38, 대한금속재료학회, 2000

85439
Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection

Lee. Hyeong Gi; Lee, Se Yong; Choi, Yong Won; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.1809 - 1815, IEEE 66th Electronic Components and Technology Conference, 2016-06-01

85440
Thermo-Elastic Analysis and Three-Dimensional Stress Analysis of Carbon/Carbon Brake Disk

Oh, Se-Hee; Yoo, Jae-Seok; Kim, Chun-Gon; Hong, Chang-Sun; Kim, Kwang-Soo; Park, Jong-Hyun, The Third Korea-Japan Symposium of Composite Materials, pp.9 - 10, 2002-10

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