Showing results 12681 to 12700 of 109410
Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF Yang, SY; Kwon, WS; Lee, SB; Paik Kyung-Wook, 5th International Symposium on Electronic Materials and Packagings 2003, 2003-11 |
Analytical Asymptotic Extraction Techniques for Gap Discontinuities Park, SeongOok, Int. Symposium on Elect. Theory Proc. Thessaloniki Greece i, pp.136 - 138, 1998-01 |
Analytical calculation of hydrodynamic coefficients of an oscillating horizontal circular cylinder using the bi-polar coordinate Cho, Yeunwoo; Jeon, Wonju; Lee, Gibbeum, 74th Annual Meeting of the APS Division of Fluid Dynamics, American Physical Society, 2021-11-21 |
Analytical calculation of the added mass and the wave damping due to an oscillating horizontal circular cylinder using the bi-polar coordinate Lee, Gibbeum; Cho, Yeunwoo, 71st Annual Meeting of the APS Division of Fluid Dynamics, APS (American Physical Society), 2018-11-19 |
Analytical Characterization of Al Matrix Composites Reinforced with 3D Orthogonal Carbon Textile Preforms Hong, Soon-Hyung, 3rd Japan-Korea Joint Symposium on Composite Materials, pp.15 - 16, 2002-10-01 |
Analytical Characterization of Carbon Fiber Textile Reinforced Al Matrix Composites Hong, Soon Hyung, pp.71 - 74, 2002-11-01 |
Analytical comparison of three packet scheduling schemes under a per-user minimum throughput assurance requirement in HSDPA Seo, Y.I.; Sung, Dan Keun, 2005 IEEE 16th International Symposium on Personal, Indoor and Mobile Radio Communications, PIMRC 2005, v.3, pp.1708 - 1712, 2005-09-11 |
Analytical Criteria for Collision Avoidance between Two Encountering Ships Park, Jeonghong; Kim, Jinwhan; Son, Namsun, MARSIM 2012, Singapore Maritime Academy(SMA), 2012-04-26 |
Analytical design and simulation studies of super-junction power MOSFET Pravin N. K., 2007 IEEE International Symposium on Industrial Electronics, ISIE 2007, pp.503 - 508, 2007-06-04 |
Analytical Evaluation of the Asymptotic Impedance Matrix of a Uniaxial Substrate with Roof-Top Functions Park, SeongOok, EMC2002, 2002-05 |
Analytical Expressions for Maximum Transferred Power in Wireless Power Transfer Systems Kogn, Sunkyu; Kim, Myunghoi; Koo, Kyongchoul; Ahn, Seungyoung; Bae, Bumhee; Kim, Joungho, 2011 IEEE Electromagnetic Compatibility Symposium, 2011 IEEE Electromagnetic Compatibility Symposium, 2011-08-17 |
Analytical expressions for maximum transferred power in wireless power transfer systems Kong, Sunkyu; Kim, Myunghoi; Koo, Kyoungchoul; Ahn, Seungyoung; Bae, Bumhee; Kim, Joungho, 2011 IEEE International Symposium on Electromagnetic Compatibility (EMC), IEEE, 2011-08-15 |
Analytical Expressions of Differential-mode Harmonics in Loosely-coupled Series-resonant Wireless Power Transfer System Kim, Hongseok; Fan, Jun; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.648 - 653, Institute of Electrical and Electronics Engineers Inc., 2019-07 |
Analytical Investigation of Approximating the Optimal Operating Condition of Multi-receiver Wireless Power Transfer Systems in Real Time Kim, Mingi; Jang, In Gwun, Asian Congress of Structural and Multidisciplinary Optimization 2022, International Society for Structural and Multidisciplinary Optimization, 2022-05 |
Analytical investigation of the stabilizing function of the musculoskeletal system using Lyapunov stability criteria and its robotic applications Chang, Handdeut; Kim, Sangjoon Jonathan; Kim, Jung, International Conference on Intelligent Robots and Systems 2016, IEEE Robotics and Automation Society (RAS), 2016-10-12 |
Analytical investigation of urban SAR features having a group of corner reflectors Lee W.K., 2001 International Geoscience and Remote Sensing Symposium (IGARRS 2001), pp.1282 - 1284, IEEE, 2001-07-09 |
Analytical Model for Predicting the Electromagnetic Fields Intensity in Wireless Power Transfer Systems Kong,Sunkyu; Hwang, Culsoon; Kim, Kiyeong; Kim, Heegon; Park ,Laehyuk; Park, Unkyoo; Kim, Ji Seong; et al, 2011 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS 2011, 2011-09-01 |
Analytical Model for Thermal Expansion Coefficients of Plain Woven Fabric Composites Hong, Soon-Hyung; Lee, SK; Byun, JH, Proceeding of the 3rd International Symposium on Textile Composites in Building Construction, pp.177 - 186, 1996 |
Analytical Model for Thermal Expansion Composites in Building Construction Hong, Soon-Hyung, 177, 1996-01-01 |
Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards Kim, Jingook; Rotaru, Mihai Dragos; Lee, Junwoo; Park, Jongbae; Alexander, Popov; layer, Mahadevan K.; Kim, Joungho, 5th IEEE Electronics Packaging Technology Conference, pp.45 - 50, IEEE, 2003-12 |
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