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Showing results 72081 to 72100 of 99846

72081
Sigmoidal spectral conversion with changeable dynamic region for speech feature extraction

Oh, KC; Lee, Hwang Soo, ELECTRONICS LETTERS, v.35, no.2, pp.125 - 126, 1999-01

72082
Sign change in the organic magnetoresistance of tris(8-hydroxyquinolinato)aluminum upon annealing

Kang, Ho-Ju; Lee, Ik-Jae; Yoon, Choon-Sup, APPLIED PHYSICS LETTERS, v.100, no.7, 2012-02

72083
Signal Amplification in Drosophila Olfactory Receptor Neurons

Kim, Byoung Soo; Suh, Seong Bae, NEURON, v.104, no.5, pp.829 - 831, 2019-12

72084
Signal Design for Reduced Complexity and Accurate Cell Search/Synchronization in OFDM-Based Cellular Systems

Chang, Kapseok; Ho, Paul; Choi, Yonghoon, IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY, v.61, no.9, pp.4170 - 4175, 2012-11

72085
Signal detection using biphotons and potential application in axion-like particle search

Le Phuong Hoang; Xuan Binh Cao, NUCLEAR PHYSICS B, v.961, pp.115215, 2020-12

72086
Signal Encoder of Real-Time Bio-Aerosol Counter Using 280 nm UV-LED Induced Fluorescence

Park, Jinho; Jeong, Young-Su; Nam, Hyunwoo; Choi, Kibong, IEEE SENSORS JOURNAL, v.20, no.22, pp.13471 - 13479, 2020-11

72087
Signal flow control of complex signaling networks

Lee, Daewon; Cho, Kwang-Hyun, SCIENTIFIC REPORTS, v.9, 2019-10

72088
Signal Generation due to Alpha Particle in Hydrogenated Amorphous Silicon Radiation Detectors

Kim, HoKyung; Cho, Gyu-Seong, NUCLEAR ENGINEERING AND TECHNOLOGY , v.28, no.4, pp.397 - 404, 1996-06

72089
SIGNAL GENERATION IN A HYDROGENATED AMORPHOUS-SILICON DETECTOR

QURESHI, S; PEREZMENDEZ, V; KAPLAN, SN; FUJIEDA, I; Cho, Gyuseong; STREET, RA, IEEE TRANSACTIONS ON NUCLEAR SCIENCE, v.36, no.1, pp.194 - 198, 1989-02

72090
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface

Kim, Hyunwoong; Lee, Seonghi; Park, Jongcheol; Shin, Yujun; Woo, Seongho; Kim, Jongwook; Cho, Jaeyong; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.5, pp.700 - 714, 2023-05

72091
Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory

Kim, HyunWoong; Park, Jongcheol; Lee, Sanguk; Kim, Jongwook; Ahn, Seungyoung, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.12, pp.1973 - 1988, 2023-12

72092
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme

Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11

72093
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08

72094
Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Song, Jinwook; Park, Junyong; Lee, Seongsoo; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.107 - 121, 2019-01

72095
Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09

72096
Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network

Shin, Taein; Park, Shinyoung; Kim, Seongguk; Kim, Subin; Son, Kyungjune; Park, Hyunwook; Lho, Daehwan; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.7, pp.1122 - 1136, 2021-07

72097
The Signal Outside Directors Send to Foreign Investors

Rhee, Mooweon; Lee, Ji-Hwan, KAIST Business School Working Paper Series KBS-WP-2007-002, 2007-04

72098
Signal Power-Insensitive Analog MEMS Tunable Capacitor by Immobilizing the Movable Plates

Yang, Hyun-Ho; Han, Chang-Hoon; Choi, Seon-Jin; Choi, Dong-Hoon; Yoon, Jun-Bo, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.24, no.5, pp.1545 - 1556, 2015-10

72099
Signal Processing Advances for 3G WCDMA: From Rake Receivers to Blind Techniques

Sung, Youngchul; Lim, Yirang; Tong, Lang; van der Veen, Alle-Jan, IEEE COMMUNICATIONS MAGAZINE, v.47, no.1, pp.48 - 54, 2009-01

72100
Signal processing algorithm for transmission-type Fabry-Perot interferometric optical fiber sensor

Kim, SH; Lee, Jungju; Kwon, Dong-Soo, SMART MATERIALS STRUCTURES, v.10, no.4, pp.736 - 742, 2001-08

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