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| Effects of Cr/Al underlayer on magnetic properties and crystallography in CoCrPtTa/Cr/Al thin films Chang, HS; Shin, KH; Lee, Taek Dong; Park, Joong Keun, IEEE TRANSACTIONS ON MAGNETICS, v.32, no.5, pp.3617 - 3619, 1996-09 |
| Effects of Cr2N on the pitting corrosion of high nitrogen stainless steels Ha, H; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.52, pp.2175 - 2180, 2007-01 |
| Effects of CrMo spacer layer on thermal stability and magnetic properties in an antiferromagnetically coupled medium Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.93, no.10, pp.7771 - 7773, 2003-05 |
| Effects of crosstalk in WDM systems using spectrum-sliced light sources Jang, YS; Lee, Chang-Hee; Chung, YC, IEEE PHOTONICS TECHNOLOGY LETTERS, v.11, no.6, pp.715 - 717, 1999-06 |
| Effects of Crystallinity and Molecular Weight on the Melting Behavior and Cell Morphology of Expanded Polypropylene in Bead Foam Manufacturing Jang, Byung Kak; Kim, Mun Ho; Park, O. Ok, MACROMOLECULAR RESEARCH, v.28, no.4, pp.343 - 350, 2020-04 |
| Effects of Cu addition on the creep rupture properties of a 12% Cr steel Ku, BS; Yu, Jin, SCRIPTA MATERIALIA, v.45, no.2, pp.205 - 211, 2001-07 |
| Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
| Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy Jeon, YD; Paik, Kyung-Wook; Ostmann, A; Reichl, H, JOURNAL OF ELECTRONIC MATERIALS, v.34, pp.80 - 90, 2005-01 |
| Effects of Cu on the passive film stability of Fe-20Cr-xCu (x=0, 2,4 wt.%) alloys in H2SO4 solution Oh, Kkoch-Nim; Toor, Ihsan-ul-Haq; Ahn, Soo-Hoon; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.88, pp.170 - 176, 2013-01 |
| Effects of Cu substrate morphology and phase control on electrochemical performance of Sn-Ni alloys for Li-ion battery Shin, Na-Ry; Kang, Yong-Mook; Song, Min-Sang; Kim, Dong-Yung; Kwon, Hyuk-Sang, JOURNAL OF POWER SOURCES, v.186, no.1, pp.201 - 205, 2009-01 |
| Effects of Cu/AI intermetallic compound (IMC) on copper wire and aluminum pad bondability Kim, HJ; Lee, JY; Paik, Kyung-Wook; KOh, KW; Won, J; Choe, S; Lee, J; et al, IEEE TRANSACTIONS ON COMPONENETS PACKAGING AND MANUFACTURING TECHNOLOGY, v.26, no.2, pp.367 - 374, 2003-06 |
| Effects of Cu/In Compositional Ratio on the Characteristics of CuInS2 Absorber Layers Prepared by Sulfurization of Metallic Precursors Lee, Seung Hwan; Shin, Seung Wook; Han, Jun Hee; Lee, JeongYong; Kang, Myeong Gil; Agawane, G. L.; Yun, Jae Ho; et al, ELECTRONIC MATERIALS LETTERS, v.8, no.2, pp.191 - 197, 2012-04 |
| Effects of culture temperature and pH on flag-tagged COMP angiopoietin-1 (FCA1) production from recombinant CHO cells: FCA1 aggregation Hwang, Su-Jeong; Yoon, Sung-Kwan; Koh, Gou-Young; Lee, Gyun-Min, APPLIED MICROBIOLOGY AND BIOTECHNOLOGY, v.91, no.2, pp.305 - 315, 2011-07 |
| Effects of Curing Agent and Curing Temperature on Material Properties of Epoxy/BaTiO3 Composite Embedded Capacitor Films Lee, Hyeong Gi; Paik, Kyung-Wook, IEEE Transactions on Components Packaging and Manufacturing Technology, v.5, no.4, pp.451 - 459, 2015-04 |
| Effects of curing condition of solution cast NafionA (R) membranes on PEMFC performance Vengatesan, Singaram; Cho, EunAe; Kim, Hyoung-Juhn; Lim, Tae-Hoon, KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.26, no.3, pp.679 - 684, 2009-05 |
| EFFECTS OF CURING CONDITIONS ON THE PROPERTIES OF THE DYNAMICALLY CURED EPDM/HDPE BLENDS KIM, DH; Kim, Sung Chul, POLYMER BULLETIN, v.21, no.4, pp.401 - 408, 1989-04 |
| Effects of curing regime, cement type, and water-to-cement ratio on the physicochemical, mechanical, and hydraulic properties of pervious mortar Das, Kunal Krishna; Sharma, Raju; Dutta, Sagar; Seo, Joonho; Jang, Jeong Gook, CONSTRUCTION AND BUILDING MATERIALS, v.401, 2023-10 |
| EFFECTS OF CYCLIC HEATING THROUGH ALPHA ' REVERSIBLE GAMMA PHASE-TRANSFORMATIONS DURING SINTERING OF FE-NI ALLOY POWDER COMPACTS CHOI, HS; Yoon, Young-Ku; PARK, WK, INTERNATIONAL JOURNAL OF POWDER METALLURGY, v.9, no.1, pp.23 - 37, 1973 |
| Effects of Cyclic Ratio of Overstress to Understress on Cumulative Fatigue Damage of SUS410J1 Stainless Steel Jono, M; Song, Ji Ho; Uchida, H, 일본기계학회논문집 A (TRANSACTIONS OF JSME - SERIES A), v.50, no.453, pp.973 - 979, 1984 |
| Effects of Cyclic Stress on the Creep Behaviour and Dislocation Microstructure of Pure Copper in the Temperature Range 0.4 to 0.5Tm j.k. lee; Nam, Soo Woo, JOURNAL OF MATERIALS SCIENCE, v.23, pp.2051 - 2058, 1988 |
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