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Showing results 208161 to 208180 of 275271

208161
Development of a gelatin-based biological glue

Bae, S.K.; Sung, T.-H.; Kim, Jong-Duk, The Controlled Release Society Anuual Meeting, no.26, pp.739 - 740, The Controlled Release Society, 1999-06-21

208162
조선시대 서울의 상업문화

Ko, Dong-Hwan, 1999년 서울문화사학회 학술대회, pp.75 - 88, 서울문화사학회, 1999-06-19

208163
Rapid defect inspection of display devices with optical spatial filtering

Kim, Seung-Woo; Yoon Dong-Seon, Proceedings of the 1999 Optical Measurement Systems for Industrial Inspection, pp.255 - 261, SPIE, 1999-06-16

208164
Enhancement of AFM image by compensating the Hysteresis and Creep effect within PZT

Gweon, Dae-Gab; Jung, He Won; Shim, Jong Youp, SPIE Conf. on Optical Engineering for Sensing and Nanotechnology, pp.327 - 330, Society of Photo-optical Instrumentation Engineers, 1999-06-16

208165
Nanoparticle Formation by Lipid-conjugated Thermal Proteins

Bae, SK; Kim, Jong-Duk, 73rd ACS Colloid and Surface Science Symposium, pp.0 - 0, ACS, 1999-06-15

208166
Evaluation of W/O Emulsion Stability by Turbidity Ratio Measurement

Song, MG; Kim, JY; Jho, SH; Kim, Jong-Duk, 73th ACS Colloid and Surface Science Symposium, 1999, pp.0 - 0, ACS, 1999-06-15

208167
Hierarchical Vertical Decompositions, Ray Shooting, and Circular Arc Queries in Simple Polygons

Cheng, Siu-Wing; Cheong, Otfried; Everett, Hazel; Oostrum, Ren van, 15th Annual ACM Symposium on Computational Geometry (SoCG) 1999, pp.227 - 236, 1999-06-13

208168
Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump

Yim, MJ; Jeon, YD; Paik, Kyung-Wook, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, 1999-06-13

208169
Spanning Trees Crossing Few Barriers

Asano, Tetsuo; Berg, Mark de; Cheong, Otfried; Guibas, Leo J.; Snoeyink, Jack; Tamaki, Hisao, 15th Annual ACM Symposium on Computational Geometry (SoCG) 1999, pp.41 - 48, 1999-06-13

208170
Fatigue life assessment of bump type solder joint under vibration environment

Lee, Soon-Bok; Ham, SJ, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, pp.699 - 704, 1999-06-13

208171
Compact modeling of fluid flow and heat transfer in heat sinks

Kim, SungJin; Kim, D., InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, pp.719 - 726, 1999-06-13

208172
High-performance three-dimensional on-chip inductors fabricated by novel micromachining technology for RF MMIC

Yoon, Jun-Bo; Han, Chul-Hi; Yoon, Euisik; Kim, CK, Proceedings of the 1999 IEEE MTT-S International Microwave Symposium Digest 'The Magic Touch of Microwaves', pp.1523 - 1526, IEEE, 1999-06-13

208173
Formally Specified Monitoring of Temporal Properties

Kim, Moonzoo; Viswanathan, Mahesh; Abdallah, Hanene Ben; Kannan, Sampath; Lee, Insup, European Conference on Real-Time Systems, pp.114 - 122, ECRTS, 1999-06-09

208174
Effects of W on the Corrosion and Formation Kinetics of Second Phases of Duplex Stainless Steels

Kwon, Hyuk-Sang, Proceedings of the International Conference Stainless Steel '99—Science and Market, pp.475 - 480, 1999-06-08

208175
Design, Fabrication and Characterization of Piezoelectric Multi-layer Cantilever Microactuators for the Minimum Initial Deflection

Kim, MJ; Cho, Young-Ho, 10th Inter. Conf. Solid-State Sensors and Actuators (Transducers '99), pp.1758 - 1761, 1999-06-07

208176
Power-Efficient Coded Modulation and Precoding Schemes for Wireless Infrared Communications

Park, Hyuncheol, IEEE International Conference on Communications (ICC 1999), pp.614 - 618, IEEE, 1999-06-06

208177
Effects of Alloying Elements (Cr, Mo, Ni) on Repassivation Kinetics of Ferritic Stainless Steels

Cho, Eun-Ae; Kim, JK.; Kim, JS.; Kwon, HS., Stainless Steel '99 - Science and Market, Stainless Steel '99 - Science and Market, 1999-06-06

208178
Prediction of SCC Susceptibility of Stainless Steels Based on Repassivation Kinetics

Cho, Eun-Ae; Yeom, KA.; Kwon, HS., Stainless Steel '99 - Science and Market, Stainless Steel '99 - Science and Market, 1999-06-06

208179
MEMS Research Activities in Micromachines and Microsystems Laboratory at KAIST

Cho, Young-Ho, First MICROS International Symposium, pp.37 - 51, 1999-06-03

208180
A study on the dynamic response of interfacial crack subject to the impact load

Shin, D.K.; Lee, Jungju; Lyu, M.Y.; Kwon, Y.D., Asian-Pacific Conference for Fracture and Strength 99(APCFS'99), pp.1 - 4, 1999-06-03

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