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Showing results 183701 to 183720 of 275604
| Stress Field near a Free Edge and a Delamination Crack in a Laminated Composite Strip Im, Seyoung, CSCE Engineering Mechanics Symposium, v.0, no.0, pp.363 - 368, 1994-06 |
| Stress Field Near Teransverse Cracks under Extension or In-Plane Shear in Composite Laminates 임세영, JOURNAL OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS, v.3, no.2, pp.121 - 129, 1989-08 |
| Stress generation and annihilation during hydrogen injection into and extraction from anodic WO3 films Kim, DJ; Pyun, Su Il, ELECTROCHIMICA ACTA, v.44, no.11, pp.1723 - 1732, 1999 |
| Stress Generation during Anodic and Cathodic Polarization of Titanium Thin Film Electrode in pH 8.4 Borate Buffer Solution Pyun, Su Il, JSCE Materials and Environments 2001, 2001 |
| Stress Generation during Anodic Oxidation of Metals Pyun, Su Il, Japan-Korea Joint Seminar on Electrochemistry, pp.85 - 86, 1996 |
| Stress Generation during Anodic Oxidation of Metals 변수일, Korean Corros. Sci. Soc., pp.23 - 23, 1995 |
| Stress Generation during Anodic Oxidation of Tungsten Pyun, Su Il, Intern. Symp. on Passivity and Passivation of Metals and Semiconductors, 1994 |
| Stress Generation During Anodic Oxidation of Tungsten by Using a Laser Beam Deflection Technique 변수일, Korean Corros. Sci. Soc., pp.17 - 17, 1993 |
| Stress Generation during Hydrogen Transport through Pd Foil Electrode Using Beam Deflection Method Combined with Potentiostatic Current Transient Technique and Cyclic Voltammetry Pyun, Su Il, 203rd Meeting of the Electrochemical Society, 2003 |
| Stress Generation during the Growth of Anodic Oxide Films on Pure Aluminium Pyun, Su Il, International Symposium on Passivity of Metals and Semiconductors, 1999 |
Stress Granules Contain Rbfox2 with Cell Cycle-related mRNAs Park, Chungoo; Choi, Sunkyung; Kim, Yong-Eun; Lee, Siyeo; Park, Su-Hyung; Adelstein, Robert S.; Kawamoto, Sachiyo; et al, SCIENTIFIC REPORTS, v.7, 2017-09 |
| Stress induces behavioral abnormalities by increasing expression of phagocytic receptor MERTK in astrocytes to promote synapse phagocytosis Byun, Youkyeong Gloria; Jeon, Yi-Seon; Choi, Jong Bin; Park, Chan-Woo; Kim, Kyungdeok; Jang, Hyunsoo; Kim, Jinkyeong; et al, IMMUNITY, v.56, no.9, 2023-09 |
| Stress integration method for a nonlinear kinematic/isotropic hardening model and its characterization based on polycrystal plasticity Cardoso, Rui P. R.; Yoon, Jeong Whan, INTERNATIONAL JOURNAL OF PLASTICITY, v.25, no.9, pp.1684 - 1710, 2009-09 |
| Stress integration-based on finite difference method and its application for anisotropic plasticity and distortional hardening under associated and non-associated flow rules Choi, Hyunsung; Yoon, Jeong Whan, COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING, v.345, pp.123 - 160, 2019-03 |
| Stress intensities at the interface corner of co-cured lap joints Shin, K. C.; Kim,W. S.; Lee, Jungju, The 15th international conference on composite materials, pp.0 - 0, ICCM, 2005-07-27 |
| Stress intensities at the triple junction of a multilevel thin film package Jeon, Insu; Kang, Ki-Ju; Im, Seyoung, MICROELECTRONICS RELIABILITY, v.48, no.5, pp.749 - 756, 2008-05 |
| Stress intensity factors and crack initiation directions for ceramic/metal joint Kim, JH; Lee, Soon-Bok, THEORETICAL AND APPLIED FRACTURE MECHANICS, v.30, no.1, pp.27 - 38, 1998-09 |
| Stress intensity factors and kink angle of a crack interacting with a circular inclusion under remote mechanical and thermal loadings Lee, Saebom; Choi, Seung Tae; Earmme, Youn Young; Chung, Dae Youl, KSME International Journal, v.17, no.8, pp.1120 - 1132, 2003-08 |
| Stress Intensity Factors for Cracked Adhesively Bonded Orthotropic Plates h.s. ro; Hong, Chang Sun, INTERNATIONAL JOURNAL OF FRACTURE, v.17, no.6, pp.181 - 184, 1981 |
| Stress Intensity Factors for Cracks Emanating from a Pin-Loaded Hole by Photoelastic Method Hong, Chang Sun, Proc. of Society of Experimental Stress Analysis/JSME Conf. on Experimental Mechanics, pp.612 - 617, 1982 |
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