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Showing results 167021 to 167040 of 275599
| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, I; Lee, Soon-Bok, IEEE Transactions on Components and Packaging Technologies, pp.478 - 484, 2005 |
| Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.2, pp.478 - 484, 2008-06 |
| Reliability and Performance Analysis of Satellite On-board Time-Space-Time Switching Networks with Multiple Separated Space Switches Sung, Dan Keun; Kang, SH, Joint Conference on Communications, Networks, Switching Systems and Satellite Communications, pp.232 - 236, 1993 |
| Reliability and Performance Analysis of Time-Space-Time Swiching Networks with Multiple Separated Space Switches Sung, Dan Keun; Kang, SH, International Teletraffic Congress, pp.111 - 116, 1991 |
| Reliability and performance analysis of time-space-time switching networks with multiple separated space switches Sung, Dan Keun; Kang, Sang H, QUALITY AND RELIABILITY ENGINEERING INTERNATIONAL, v.8, no.4, pp.335 - 340, 1992-07 |
| Reliability and performance improvement techniques for counter caches in secure memories = 시큐어 메모리의 카운터 캐시 최적화를 통한 신뢰성 및 성능 향상 기법link 김제성; Kim, Soontae; 김순태, 한국과학기술원, 2022 |
| RELIABILITY AND RISK ALLOCATION IN NUCLEAR-POWER-PLANTS - A DECISION-THEORETIC APPROACH PAPAZOGLOU, IA; Cho, Nam-Zin; BARI, RA, NUCLEAR TECHNOLOGY, v.74, no.3, pp.272 - 286, 1986-09 |
| Reliability and Security in the CoDeeN Content Distribution Network Park, KyoungSoo, USENIX Annual Technical Conference (USENIX ATC), USENIX, 2004-06-29 |
| RELIABILITY APPORTIONMENT FOR PHASED-MISSION ORIENTED SYSTEMS Park, Kyung Soo; YOO, YK, RELIABILITY ENGINEERING SYSTEM SAFETY, v.27, no.3, pp.357 - 364, 1990-03 |
| Reliability assessment method for NPP digital I&C systems considering the effect of automatic periodic tests Lee, Seung Jun; Choi, Jong Gyun; Kang, Hyun Gook; Jang, Seung-Cheol, ANNALS OF NUCLEAR ENERGY, v.37, no.11, pp.1527 - 1533, 2010-11 |
| Reliability Assessment of Advanced Electronics Packaging and MEMS(Key-Note Speech) Lee, Soon-Bok, Tokyo Tech-KAIST joint workshop, pp.3 - 4, 2005 |
| Reliability assessment of advanced materials and structures Lee, Soon-Bok, APCMM09, 2009-11 |
| Reliability Assessment of Advanced Materials and Structures Lee, Soon-Bok, JOURNAL OF SOLID MECHANICS AND MATERIALS ENGINEERING, v.4, no.6, pp.639 - 651, 2010-07 |
| Reliability assessment of BGA solder joints under cyclic bending loads Kim, Ilho; Lee, Soon-Bok, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.27 - 32, 2005-12-11 |
| Reliability Assessment of Electronic Packaging and Thin Film Lee Soon-Bok, ICMR2011(International Conference on Materials Reliability 2011), KSME, 2011-11 |
| Reliability Assessment of Electronic Packaging with Hybrid Approach of Experimental and Computational Mechanics Lee, Soon-Bok; Kim, Ilho, APCOM'07 in conjunction with EPMESC XI, 2011-08-12 |
| Reliability Assessment of Electronics Packaging and Thin Films for Flexible Electronics Lee, Soon-Bok, 2014 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), Quality, Reliability, Risk, Maintenance, and Safety Engineering(QR2MSE 2014), 2014-07-22 |
| Reliability Assessment of Electronics Packaging with Fringe Pattern Analysis Lee, Soon-Bok; Ham, Suk-Jin, ICEM05, pp.17 -, 2005 |
| Reliability assessment of embedded digital system using multi-state function Choi, JG; Seong, Poong-Hyun, RELIABILITY ENGINEERING & SYSTEM SAFETY, v.91, no.3, pp.261 - 269, 2006-03 |
| RELIABILITY ASSESSMENT OF LEAD-FREE SOLDER JOINTS IN ELECTRONICS PACKAGING Lee, Soon-Bok, UKC 2008, 2008 |
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