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Showing results 131101 to 131120 of 279400
| Microwave characterization and comparison of adhesive flip chip interconnects Kwon, WS; Jeon, YD; Lee, JH; Nah, JW; Yim, MJ; Paik, Kyung-Wook, Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.273 - 278, 2001-07-08 |
| Microwave dielectric ceramic composition Kim, Ho-Gi; Park, Yung |
| Microwave dielectric properties of epitaxial BaTiO3 film Choi, Si-Kyung; Cho, YW; Hyun, TS, The 16th international Symposium on Integrated Ferroelectrics, 2004 |
| Microwave dielectric properties of ferroelectric BaTiO3 thin film Choi, Si-Kyung; Cho, YW; Hyun, TS, KAIST-Kyoto University Joint Symposium on Materials Science and Engineering for the 21st Century, pp.96 -, 2003 |
| Microwave dielectric properties of ferroelectric BaTiO3 thin film Choi, Si-Kyung; Cho, YW, International Conference on Electroceramics, MIT, USA, pp.211 -, 2003 |
| Microwave dielectric properties of ferroelectric BaTiO3 thin film Cho, YW; Hyun, TS; Choi, Si-Kyung, JOURNAL OF ELECTROCERAMICS, v.13, no.1-3, pp.251 - 255, 2004-07 |
| Microwave double-pole double-throw switch and microwave divide/through switch and power amplifier using thereof 홍성철, 2003-12-23 |
| MICROWAVE EMISSION FROM AN IRREGULAR SNOW LAYER Eom, Hyo Joon; LEE, KK; FUNG, AK, REMOTE SENSING OF ENVIRONMENT, v.13, no.5, pp.423 - 437, 1983 |
| Microwave Engineering Education at KAIST Ra, Jung Woong, Asia-Pacific Microwave Technology and Educatuon Workshop, 1991 |
| Microwave extraction of graphene from carbon fibers Sridhar, V; Jeon, JH; Oh, Il-Kwon, CARBON, v.49, no.1, pp.222 - 226, 2011-01 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Kim, H.; Choi, B.K.; Kim, J.-M.; Hong, J.-K.; et al, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, no.2, pp.265 - 271, 2002-05 |
| Microwave frequency crosstalk model of redistribution line patterns on wafer level package Sung, M.; Kim, N.; Lee, J.; Choi, B.; Park, I.; Hong, J.-K.; Kwon, Y.; et al, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp.109 - 112, IEEE, 2001-10-29 |
| Microwave Frequency Dielectric Constant and Loss Tangent Measurements of PCB materials Using Stripline Structure Kim, Joungho; Kim, Jingook; Lee, Junho; Kim, Namhoon; Lee, Junwoo, APACK2001, 2001 |
| Microwave Frequency Generation, Switching, and Controlling Using Single-Mode FP-LDs Nakarmi, Bikash; Chen, Hao; Won, Yong Hyub; Pan, Shilong, JOURNAL OF LIGHTWAVE TECHNOLOGY, v.36, no.19, pp.4273 - 4281, 2018-10 |
| Microwave frequency interconnection line model of a wafer level package Lee, J; Ryu, W; Kim, Joungho; Kim, N; Pak, J; Kim, JM, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.25, pp.356 - 364, 2002-08 |
| Microwave frequency measurement and modeling of flip chip interconnects = 플립칩 패키지의 마이크로파 주파수 영역에서의 측정 및 모델링에 관한 연구link Kwon, Woon-Seong; 권운성; et al, 한국과학기술원, 2001 |
| Microwave Frequency Model of Flip-Chip interconnects using Anisotripic Conductive Film Kim, Joungho, HDP/MCM conference, 1999 |
| Microwave frequency model of flip-chip interconnects using anisotropic conductive film Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06 |
| Microwave frequency model of FPBGA solder ball extracted from S-parameters measurement Lee, Jungho; Ahn, Seungyoung; Kwon, Woon-Seong; Paik, Kyung-Wook; Kim, Joungho, IEICE TRANSACTIONS ON ELECTRONICS, v.E87C, pp.1621 - 1627, 2004-09 |
| Microwave frequency model of wafer level package based on s-parameter measurement = S-파라미터 측정을 통한 마이크로파 영역에서의 Wafer Level Package 모델에 관한 연구link Lee, Jun-Woo; 이준우; et al, 한국과학기술원, 2001 |
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