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Showing results 76381 to 76400 of 225807

76381

FlightGoggles 시뮬레이터를 이용한 Drone의 Visual-Inertial 상태 추정(VINS-Mono)에 관한 분석

이응창; 위인환; 김태연; 문상근; 심현철researcher, 한국항공우주학회 2019년도 춘계학술대회, 한국항공우주학회, 2019-04-18

76382

Flip Chip Assembly on Board using Anisotropic Conductive Adhesive/Film and Nickel-Gold Bump

Paik, Kyung-Wookresearcher, Advances in Electronic Packaging, pp.367 - 372, 1999-06-01

76383

Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps

백경욱researcher, 한국재료학회 추계학술대회, pp.81 - 81, 한국재료학회, 1998-11-01

76384

Flip Chip Assembly on Organic Boards Using Anisotropic Conductive Adhesives(ACAs) and Nickel/Gold Bumps

Yim, MJ; Jeon,YD; Paik, Kyung-Wookresearcher, 2000 Electronics Packaging Technology Conference(3rd EPTC), pp.378 - 384, 2000-12-01

76385

Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump

Yim, MJ; Jeon, YD; Paik, Kyung-Wookresearcher, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, 1999-06-13

76386

Flip chip assembly on PCB substrates with coined solder bumps

Nah, JW; Paik, Kyung-Wookresearcher; Cho, SJ; Kim, WH, 53rd Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2003-05-27

76387

Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

임명진; 김형준; 백경욱researcher, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03

76388

Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications

Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27

76389

Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications

Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wookresearcher, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12

76390

Flip Chip on Organic Board Technology using Modified Anisotropic Conductive Films and Electroless Nickel/Gold Bump

백경욱researcher; 임명진; 전영두, 한국마이크로전자 및 패키징학회지, v.6, no.2, pp.13 - 21, 1999-06

76391

Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구

백경욱researcher; 전영두; 임명진, 한국재료학회지, v.9, no.11, pp.1095 - 1101, 1999-11

76392

Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구

전영두; 임명진; 백경욱researcher, 한국재료학회지, v.9, no.11, pp.1095 - 1101, 1999-11

76393

Flip-chip alignment with a dual imaging system using a visual servoing method

Lee D.; Tao X.; Cho, Hyungsuckresearcher; Cho Y., Optomechatronic Systems Control, v.6052, pp.605203-1 - 605203-12, International Society for Optical Engineering (SPIE), 2005-12-05

76394

Flip-chip assembly on soft polymer substrate using ACP for integrating readout circuitry for modular expandable tactile sensor array

Chang S.-I.; Lee H.-K.; Yoon E.researcher, 13th International Conference on Solid-State Sensors and Actuators and Microsystems, TRANSDUCERS '05, v.2, pp.1969 - 1972, 2005-06-05

76395

Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump

Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoonresearcher; Jeon, DukYoungresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02

76396

Flip-Chip-on-Glass(FCOG) Technology using Electroless Ni/Cu/Au bump and ACF for LCD Packaging

Paik, Kyung-Wookresearcher, Liquid Crystal Materials and Device '99, pp.199 - 204, 1999-09-01

76397

Flip-Chip을 이용한 C-Band 부하선로방식 위상 변위기의 설계 및 제작

이귀로researcher; 어윤성, 대한전자공학회 학술대회 , pp.291 - 292, 대한전자공학회, 1995

76398

Flip-chip을 이용한 C-band 부하선로방식 위상변위기의 설계 및 제작 = C-band loaded line phase shifter using flip-chip bonding techniquelink

어윤성; Eo, Yun-Seong; et al, 한국과학기술원, 1995

76399

Flipped-state Identification in a Rydberg Wave-packet using a Terahertz Half-cycle Pulse

Ahn, Jaewookresearcher; Hutchinson, D.N.; Rangan, C.; Bucksbaum, P.H., Technical Digest:Proceedings in CLEO/QELS 2001, pp.93 - 93, Optical Society of America, 2001-05

76400

Floating absorber for safety at transient analysis code(FASTAC): verification and validation

LEE, SEONGMIN; Jeong, Yong Hoonresearcher, The 12th International Topical Meeting on Nuclear Thermal-Hydraulics, Operation and Safety (NUTHOS-12), Chinese Nuclear Society and American Nuclear Society, 2018-10-16

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