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Showing results 71141 to 71160 of 275509
| Effect of conditioned medium on transformation and cultivation of Nanochloropsis salina 강남규; 이봉수; 신성은; 김은경; 전승집; 박민성; 양지원, (재)차세대바이오매스연구단 워크숍, Advanced Biomass research Center, 2015-01-22 |
| Effect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE 11th International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp.38 - 0, 123, 2006-03-15 |
| Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10 |
| Effect of confinement on heat transfer characteristics of a microscale impinging jet Youn, Young-Jik; Choo, Kyo-Sung; Kim, Sung-Jin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.54, no.1-3, pp.366 - 373, 2011-01 |
| Effect of conjugated linoleic acid isomer, t10c12, c9t11-CLA and mixed form on cirrhosis induced by carbon tetrachloride Jeong, Won-il, FASEB meeting, Experimental biology, pp.939 - 939, 2004 |
| Effect of Constitutively Active Ras Overexpression on Cell Growth in Recombinant Chinese Hamster Ovary Cells Kim, Yeon-Gu; Han, Young-Kue; Kim, Jee-Yon; Lee, Eun-Gyo; Lee, Hong-Weon; Lee, Gyun-Min, BIOTECHNOLOGY PROGRESS, v.27, no.2, pp.577 - 580, 2011 |
| Effect of Constraint Release and Tube Renewal on the Binary Blends of Entangled Linear Polymers S.B. Kim; K.M. Kim; I.J. Chung, KOREAN JOURNAL OF RHEOLOGY, v.3, no.2, pp.166 - 174, 1991 |
| Effect of Constriction on Phonon Transport in Silicon Thin Films and Nanowires Dulhani, Jay; Lee, Bong Jae, SMART SCIENCE, v.4, no.4, pp.173 - 179, 2016 |
| Effect of contact angle on contact morphology and Vickers hardness measurement in instrumented indentation testing Kang, Seung-Kyun; Kim, Young-Cheon; Lee, Jin-Woo; Kwon, Dongil; Kim, Ju-Young, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.85, pp.104 - 109, 2014-08 |
| Effect of Contact Points Feedback on Two-Thumb Touch Typing in Virtual Reality 손정민; Ahn, Sunggeun; Kim, Sunbum; Lee, Geehyuk, 2022 CHI Conference on Human Factors in Computing Systems, CHI EA 2022, Association for Computing Machinery, 2022-05 |
| Effect of contact pressure on current density distribution of electric contacts Park, S.W.; Na, Suck-Joo, Spring Annual Conference of KSME, pp.209 - 212, 1987-07 |
| Effect of contact resistance on the effective thermal conductivity of vacuum insulation panels with radiation shields Lee, Jae Hyug; Song, Tae Ho, 12th International Vacuum Insulation Symposium (IVIS 2015), Nanjing University of Aeronautics and Astronautics (NUAA), 2015-09-20 |
| Effect of contact-line drag on behavior of drop impinging onto flat surfaces Kee, June Woo; Kim, Woo Shik; Lee, Sang Yong, 25th International Symposium on Transport Phenomena (ISTP-25), King Mongkut's Institute of Technology Ladkrabang, 2014-11-05 |
| Effect of continuous hybrid process on mechanical and electrical properties of rectangular pure copper wire Joo, Ho Seon; Hwang, Sun Kwang; Kim, Yong Nam; Im, Yong-Taek, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.244, pp.51 - 61, 2017-06 |
| Effect of Control and Data frame Overhead on the Capacity Scaling of a Hierarchical Cooperation Scheme Kim, T.H.; Chu, E.M.; Bang, I.K.; Kim, S.H.; Sung, Dan Keun, IEEE WCNC 2014, IEEE, 2014-04 |
| Effect of Controlled Rolling and Heat Treatment on Low Temperature Tensile Properties of Austenitic Fe-28Mn-1Al alloy Y.G. Kim; J.M. Han, MATERIALS LETTERS, v.8, pp.599 - 601, 1988 |
| Effect of Cooling Rate after Hot Rolling on Mechanical Properties of Annealed Micro-Alloyed Low Carbon Steel Hong, Soon-Hyung, Fall Conference of the Korean Institute of Metals and Materials, pp.107 - 107, 2008-10-24 |
| Effect of cooling rate on growth of the intermetallic compound and fracture mode of near-eutectic Sn-Ag-Cu/Cu pad: Before and after aging Jeong, SW; Kim, JH; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1530 - 1544, 2004-12 |
| Effect of Cooling Rate on IMC and Mechanical Properties of Sn-Ag-Cu/Cu Pad Jeong, Sang Won; Lee, Hyuck-Mo; Kim, Jong-Hoon, 133rd TMS Annual Meeting, 133rd TMS Annual Meeting, 2004-03 |
| Effect of Cooling Rate on the Microstructures and Mechanical Properties of Sn-Ag-Cu Lead-free Solder Joints on Cu Substrate Lee, Hyuck Mo; Jeong, SW, The 65th World Foundry Congress, pp.565 - 571, 2002-10-20 |
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