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| Thermal signature: a simple yet accurate thermal index for floorplan optimization Kung, J; Han, I; Sapatnekar, S; Shin, Youngsoo, 48th ACM/IEEE/EDAC Design Automation Conference (DAC), pp.108 - 113, ACM Special Interest Group on Design Automation (SIGDA), 2011-06-08 |
| Thermal Signature: An Accurate and Fast Thermal Model = Thermal Signature: 정확하고 빠른 온도 지표link Kung, Jae-Ha; 궁재하; et al, 한국과학기술원, 2012 |
| Thermal signature: 자동 floorplanning을 위한 빠르고 정확한 온도 지표 신영수, 한국반도체학술대회, 한국반도체학회, 2011 |
| Thermal sintering of solution-deposited nanoparticle silver ink films characterized by spectroscopic ellipsometry Pan, Heng; Ko, Seung Hwan; Grigoropoulos, Costas P., APPLIED PHYSICS LETTERS, v.93, no.23, 2008-12 |
| Thermal SMA를 이용한 C.elegans 모방로봇의 디자인 및 컨트롤 육현우; 신현정; 조성호, 대한기계학회 2010년도 바이오공학부문 춘계학술대회 , pp.133 - 133, 대한기계학회, 2010-04-29 |
| Thermal SMA를 이용한 C.elegans 모방로봇의 디자인 및 컨트롤 육현우; 조성호; 신현정, 2010 대한기계학회 바이오공학부문 춘계학술대회, pp.133, 대한기계학회, 2010-05-01 |
| Thermal snapping and vibration characteristics of cylindrical composite panels using layerwise theory Oh, Il-Kwon; Lee, In, COMPOSITE STRUCTURES, v.51, no.1, pp.49 - 61, 2001-01 |
| Thermal softening behavior up to fracture initiation during high-rate deformation Lee, Chang Soo; Yoon, Jeong Whan; Woo, Sang Hyun; Park, Lee Ju, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.251, 2023-08 |
| Thermal spin current originated from spin Nernst effect in ferromagnet/heavy metal bilayer structures Kim, Dong Jun; C. Jeon; Park, Byong-Guk, Intermag Dublin 2017, International Union of pure and applied physics, 2017-04-25 |
| Thermal spin injection and accumulation in CoFe/MgO tunnel contacts to n-type Si through Seebeck spin tunneling Jeon, Kun-Rok; Min, Byoung-Chul; Park, Seung-Young; Lee, Kyeong Dong; Song, Hyon-Seok; Park, Youn-Ho; Shin, Sung-Chul, APPLIED PHYSICS LETTERS, v.103, no.14, pp.142401, 2013-09 |
Thermal spin injection and accumulation in CoFe/MgO/n-type Ge contacts Jeon, Kun-Rok; Min, Byoung-Chul; Park, Seung-Young; Lee, Kyeong Dong; Song, Hyon-Seok; Park, Youn-Ho; Jo, Young-Hun; et al, SCIENTIFIC REPORTS, v.2, pp.01 - 07, 2012-12 |
| Thermal spin-orbit torque induced by spin Nernst effect in W/CoFeB/MgO structures Kim, jeongmok; Kim, Dongjun; Park, Byong-Guk, 14th Joint MMM-Intermag Conference, IEEE Magnetic Society, 2019-01-16 |
| Thermal spin-transfer torque driven by the spin-dependent Seebeck effect in metallic spin-valves Choi, Gyung-Min; Moon, Chul-Hyun; Min, Byoung-Chul; Lee, Kyung-Jin; Cahill, David G., NATURE PHYSICS, v.11, no.7, pp.576 - U87, 2015-07 |
| THERMAL STABILITIES AND MICROSTRUCTURES OF TUNGSTEN COMPOUND CONTACTS ON N-GAAS FABRICATED BY LOW-ENERGY ION-BEAM-ASSISTED DEPOSITION Park, Chul Soon; Lee, JS; Kang, JY; Lee, Jeong Yong, APPLIED PHYSICS LETTERS, v.59, no.14, pp.1767 - 1769, 1991-09 |
| Thermal stability and brazing characteristics of Zr-Be binary amorphous filler metals for zirconium alloy Park, CH; Han, YS; Kim, YK; Jang, KJ; Lee, Jai Young; Choi, CB; Sim, KS, JOURNAL OF NUCLEAR MATERIALS, v.254, no.1, pp.34 - 41, 1998-03 |
| Thermal stability and brazing characteristics of Zr0.7-xMxBe0.3 (M = Ti or Nb) ternary amorphous filler metals Han, YS; Park, CH; Jang, KJ; Bae, CH; Choi, CB; Lee, Jai Young, JOURNAL OF NUCLEAR MATERIALS, v.270, no.3, pp.334 - 341, 1999-04 |
| Thermal stability and electrical properties of SrBi2Ta2-xNbxO9/IrOx capacitors with Pt top electrode Kweon, SY; Choi, Si-Kyung; Yang, WS; Yeom, SJ; Roh, JS, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.40, no.9A, pp.5275 - 5280, 2001-09 |
| Thermal stability and flame retardancy of PMMA composites filled with metal oxalates = 금속 옥살레이트로 충진한 폴리메틸메타아크릴레이트 복합체의 열 안정성과 난연성에 관한 연구link Park, Sun-mi; 박선미; et al, 한국과학기술원, 2008 |
| Thermal stability and ionic conductivity of the ionic clathrate hydrates incorporated with potassium hydroxide Cha, Jong-Ho; Lee, Won-Hee; Lee, Huen, JOURNAL OF MATERIALS CHEMISTRY, v.19, no.36, pp.6542 - 6547, 2009-07 |
| Thermal Stability and Memory Characteristics of HfON Trapping Layer for Flash Memory Device Applications Jeon, Sanghun, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.12, no.11, pp.H412 - H415, 2009 |
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