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Showing results 200201 to 200220 of 275593
| Thermal Deformation and Decomposition of Dye and Polycarbonate in Compact Disc-Recordables. Kim, Sung Chul, Pacific Polymer Conference, 1997 |
| Thermal Deformations of CSP Assembly during Temperature Cycling and Power Cycling Ham, SJ; Lee, Soon-Bok, Int. symposium on Electronic Materials and Packaging, Serial 11, pp.350 - 357, IEEE, 2000-11 |
| Thermal Degradation Mechanism of PTFE Jun, HS; Woo, Seong-Ihl; Park, KY, 1987 한국고분자학회 추계학술발표회, 한국고분자학회, 1987-10 |
| Thermal degradation of blue-emitting BaMgAl10O17:Eu2+ phosphors for PDP applications 전덕영, 한국세라믹학회 추계학술대회, pp.119 -, 한국세라믹학회, 2001-10-19 |
| Thermal degradation of heterogeneous concrete materials Willam K.; Rhee I.; Xi Y., JOURNAL OF MATERIALS IN CIVIL ENGINEERING, v.17, no.3, pp.276 - 285, 2005 |
| Thermal degradation of poly(vinyl cinnamate) Kim, Hee-Tak; Park, Jung-Ki, POLYMER BULLETIN, v.41, no.3, pp.325 - 331, 1998-09 |
| THERMAL DESALINATION MEMBRANES Carbon nanotubes keep up the heat Boo, Chanhee; Elimelech, Menachem, NATURE NANOTECHNOLOGY, v.12, no.6, pp.500 - 503, 2017-06 |
| Thermal design modifications to improve firing frequency of back shooting inkjet printhead Shin, SJ; Kuk, K; Shin, JW; Lee, CS; Oh, YS; Park, Seung O, SENSORS AND ACTUATORS A-PHYSICAL, v.114, no.2-3, pp.387 - 391, 2004-09 |
| Thermal design of a combined hydrogen and oxygen supply system for a fuel cell in low-oxygen environments Kim, Dong-min; Choi, Sinwoo; Cheon, Hyungjun; Roh, Heesook; Bae, Joongmyeon; Lee, Bong Jae, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.50, no.Part D, pp.1317 - 1325, 2024-01 |
| Thermal design of a hydrogen storage system using La(Ce)Ni-5 Kim, Joong Bae; Han, Gwangwoo; Kwon, YongKeun; Bae, Joongmyeon; Cho, EunAe; Cho, SungBaek; Lee, Bong Jae, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.45, no.15, pp.8742 - 8749, 2020-03 |
| Thermal design of the conduction-cooled AC high temperature superconducting magnet below 10 K Kwon, Dohoon; Kim, Bokeum; Jeong, Sangkwon, Applied Superconductivity Conference 2022, IEEE Council on Superconductivity, 2022-10-24 |
| Thermal design of the conduction-cooled high temperature superconducting magnet for pulsating magnetic field Kwon, Dohoon; Kim, Bokeum; Choi, Jongho; Jeong, Sangkwon; Kim, Seokho, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.33, no.5, 2023-08 |
| Thermal Desorption Study of Hydrogen from Magnesium Hydride J.S. Han; M. Pezat; Lee, Jai Young, SCRIPTA METALLURGICA, v.20, pp.951 - 956, 1986 |
| Thermal Desorption Study of LaNi5 degraded by Pressure Cycling J.I. Han; Lee, Jai Young, ZEITSCHRIFT FUR PHYSIKALISCHE CHEMIE-INTERNATIONAL JOURNAL OF RESEARCH IN PHYSICAL CHEMISTRY & CHEMICAL PHYSICS, v.164, no.2, pp.1291 - 1292, 1989 |
| Thermal development of radiatively active pipe flow with nonaxisymmetric circumferential convective heat loss Kim, TY; Baek, Seung-Wook, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.39, no.14, pp.2969 - 2976, 1996-09 |
| Thermal diffusion barrier metallization based on Co-Mo powder-mixed composites for n-type skutterudite ((Mm,Sm)(y)Co4Sb12) thermoelectric devices Song, Jinseop; Kim, Yeongseon; Cho, Byung Jin; Yoo, Chung-Yul; Yoon, Hana; Park, Sang Hyun, JOURNAL OF ALLOYS AND COMPOUNDS, v.818, 2020-03 |
Thermal display glove for interacting with virtual reality Kim, Seung-Won; Kim, Sung Hee; Kim, Choong Sun; Yi, Kyoungsoo; Kim, Jun-Sik; Cho, Byung Jin; Cha, Youngsu, SCIENTIFIC REPORTS, v.10, no.1, 2020-07 |
| Thermal Dissociation Behavior and Dissociation Enthalpies of Methane-Carbon Dioxide Mixed Hydrates Kwon, Tae-Hyuk; Kneafsey, Timothy J.; Rees, Emily V. L., JOURNAL OF PHYSICAL CHEMISTRY B, v.115, no.25, pp.8169 - 8175, 2011-06 |
| Thermal dissolution mechanisms of AlN/CrN hard coating superlattices studied by atom probe tomography and transmission electron microscopy Tytko, Darius; Choi, Pyuck-Pa; Raabe, Dierk, ACTA MATERIALIA, v.85, pp.32 - 41, 2015-02 |
| Thermal distortion analysis of orbiting solar array including degradation effects of composite materials Shin, KB; Kim, Chun-Gon; Hong, Chang Sun; Lee, HH, COMPOSITES PART B-ENGINEERING, v.32, no.4, pp.271 - 285, 2001 |
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