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Showing results 200161 to 200180 of 275281

200161
Thermal Noise Modeling for Short - Channel MOSFET's

Lee, Kwyro; Shin, Hyung-Cheol; Han, Kwangseok, International Conference on Simulation of Semiconductor Processes and Devices(SISPAD), pp.79 - 82, 2003

200162
Thermal non-equilibrium effects at the stagnation wall in the unsteady micro-flow

Park, J.H.; Baek, Seung-Wook, 2001 ASME International Mechanical Engineering Congress and Exposition, v.369, no.1, pp.389 - 392, 2001-11-11

200163
Thermal optimization of a circular-sectored finned tube using a porous medium approach

Kim, SungJin; Yoo, JW; Jang, SP, JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, v.124, no.6, pp.1026 - 1033, 2002-12

200164
Thermal Optimization of a Miniature Heat Pipe with a Grooved Wick Structure Encountered in Electronic Equipment Cooling

Seo, J.K.; Kim, SungJin; Hwang, G., Proc. of 4th JSME-KSME Thermal Engineering Conference, v.1, pp.675 - 680, 2000

200165
Thermal optimization of an internally finned tube using analytical solutions based on a porous medium approach

Do, KH; Min, JY; Kim, SungJin, JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, v.129, no.10, pp.1408 - 1416, 2007-10

200166
Thermal optimization of circular tubes and heat pipes with axial internal fins = 내부 휜을 가지는 원 관 및 히트 파이프의 열성능 최적화link

Do Kyu-Hyung; 도규형; et al, 한국과학기술원, 2007

200167
Thermal optimization of heat sinks using the topology optimization method considering shape-dependent convection effects

Joo, Younghwan; Lee, Ikjin; Kim, Sung-Jin, 12th Japan-Korea-China Student Symposium, Tokyo Institute of Technology, 2018-03-16

200168
Thermal optimization of internally finned-tube in natural convection

Kim, Sung Jin; Joo, Younghwan, First Thermal and Fluids Engineering Summer Conference, ASTFE, 2015-08-11

200169
Thermal optimization of microchannel heat sink with pin fin structures

Kim, D.; Kim, SungJin, 2003 ASME International Mechanical Engineering Congress, v.3, pp.593 - 602, 2003-11-15

200170
Thermal Optimization of Microchannel Heat Sinks

Kim, SungJin, 2000 IAMS International Seminar, pp.20 - 27, 2000

200171
Thermal optimization of plate-fin heat sinks with variable fin thickness

Kim, Dong-Kwon; Jung, Jaehoon; Kim, SungJin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.53, no.25-26, pp.5988 - 5995, 2010-12

200172
Thermal Optimization of Plate-fin heat sinks with variable fin thickness

Kim, Dong Kwon; Jung, Jaehoon; Kim, SungJin, The International Heat TransferConference(IHTC-14), 2010-08-08

200173
Thermal optimization of radial plate fin heat sinks under an L-shaped flow

Lee, Gilho; Kim, Sung Jin, APPLIED THERMAL ENGINEERING, v.133, pp.580 - 587, 2018-03

200174
Thermal optimization of radial plate fin heat sinks under L-shaped flow

Lee, Gilho, 11th China-Japan-Korea Student Symposium, Zhejiang University, 2017-03-10

200175
Thermal optimization of the pin-fin heat sink with variable fin density cooled by natural convection

Lee, Young Jin; Kim, Sung Jin, APPLIED THERMAL ENGINEERING, v.190, 2021-05

200176
Thermal optimization of vertically oriented, internally finned tubes in natural convection

Joo, Younghwan; Kim, Sung Jin, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.93, pp.991 - 999, 2016-02

200177
Thermal oxidation of tantalum films at various oxidation states from 300 to 700 degrees C

Chandrasekharan, R; Park, Inkyu; Masel, RI; Shannon, MA, JOURNAL OF APPLIED PHYSICS, v.98, no.11, 2005-12

200178
Thermal Packaging of High Temperature Superconductor Bulk for Superconducting Flywheel Energy Storage

Ki, Tae-Kyung; Jeong, Sang-Kwon; Han, Young-Hee; Park, Byung-Jun, IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, v.23, no.3, 2013-06

200179
Thermal Packaging Utilizing Gallium-Based Liquid Metals

Ki, Seokgan; Nam, Youngsuk, IEEE Electron Devices Technology and Manufacturing Conference 2023, IEEE Electron Devices Society, 2023-03-08

200180
Thermal performance analysis of heat exchanger for closed wet cooling tower using heat and mass transfer analogy

Yoo S.-Y.; Kim J.-H.; Han K.-H., JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.24, no.4, pp.893 - 898, 2010

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