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Novel Sidewall Interconnection Using a Perpendicular Circuit Die for 3-D Chip Stacking Kim, Sun-Rak; Lee, Jae Hak; Lee, Seung-Seob, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.9, pp.1265 - 1272, 2015-09 |
Wafer level packages using anisotropic conductive adhesive for flip chip assembly = 이방성 전도성 접착제 용액을 이용한 웨이퍼 레벨 패키지에 관한 연구link Kim, Il; 김일; et al, 한국과학기술원, 2008 |
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