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Showing results 1 to 5 of 5

1
Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs

Kwon, WS; Paik, Kyung-Wook, JOURNAL OF APPLIED POLYMER SCIENCE, v.93, no.6, pp.2634 - 2641, 2004-09

2
Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards

Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007

3
Electrical and mechanical properties of polyethylene/MWCNT composites produced by polymerization using Cp2ZrCl2 supported on MWCNTs

Yoon, Seung Woong; Lee, Seungjun; Choi, Insung S.; Do, Youngkyu; Park, Sungjin, MACROMOLECULAR RESEARCH, v.23, no.8, pp.713 - 718, 2015-08

4
Flexible but Mechanically Robust Hazy Quantum Dot/Glass Fiber Reinforced Film for Efficiently Luminescent Surface Light Source

Lee, Hyunhwan; Kim, Yun Hyeok; Lim, Young-Woo; Jang, Junho; Kang, Seung-Mo; Bae, Byeong‐Soo, ADVANCED OPTICAL MATERIALS, v.8, no.10, pp.1902178, 2020-05

5
Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs)

Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.2, pp.65 - 73, 2009-04

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