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Showing results 1 to 3 of 3

1
Characterization of low-temperature stress hump in relation to phase formation sequence of nickel silicide

Hong, JE; Byun, JS; Kim, SI; Ahn, Byung Tae, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.44, pp.145 - 146, 2005-01

2
Characterization of Low-Temperature Stress Hump in Relation to Phase Formation Sequence of Nickel Silicide

Hong, Jeon Eui; Byun, Jeong Soo; Kim, Sun Il; Ahn, Byung Tae, Japanese Journal of Applied Physics, Vol.44, No.1A, pp.145-146, 2005

3
MOCVD $CoSi_2$ 의 열안정성 향상 및 니켈 실리사이드의 저온 응력증가 특성에 관한 연구 = Improvement in thermal stability of MOCVD $CoSi_2$ and characterization of low- temperature stress hump of nickel silicidelink

홍정의; Hong, Jeong-Eui; et al, 한국과학기술원, 2005

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