Browse by Subject Void
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| Characterization of Cu2ZnSnSe4 Thin Films Selenized with Cu2-xSe/SnSe2/ZnSe and Cu/SnSe2/ZnSe Stacks Ahn, Byung Tae; Munir, Rahim; Jung, Gwang Sun; Ko, Young Min, 한국재료학회지, v.23, no.3, pp.183 - 189, 2013-03 |
| Enhanced superplasticity in an Al-alloyed multicomponent Mn-Si-Cr-C steel Zhang, H.; Pradeep, K. G.; Mandal, S.; Ponge, D.; Choi, Pyuck-Pa; Tasan, C. C.; Raabe, D., ACTA MATERIALIA, v.63, pp.232 - 244, 2014-01 |
| Recrystallization-induced void migration in electroplated Cu films Kim, Sung-Hwan; Yu, Jin, SCRIPTA MATERIALIA, v.67, no.4, pp.312 - 315, 2012-08 |
| 두꺼운 복합재 평판의 기공에 의한 기계적 물성 저하와 비파괴적 평가 = Degradation of mechanical properties due to void in thick composite laminates and its nondestructive evaluationlink 권규남; Kwon, Kyu-Nam; et al, 한국과학기술원, 2002 |
| 초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발 Park, Seong Yeon; On, Seung Yoon; Kim, Seong Su, COMPOSITES RESEARCH, v.34, no.1, pp.47 - 50, 2021-02 |
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