Showing results 1 to 1 of 1
Characterization of adhesion property between fused silica and thermoplastic polymer film in thermal nanoimprint lithography using a novel pull-off test Kim, Kwang-Seop; Kang, Ji-Hoon; Choi, Dae-Geun; Kim, Kyung-Woong, MICROELECTRONIC ENGINEERING, v.88, no.6, pp.855 - 860, 2011-06 |
Discover