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Showing results 1 to 20 of 187263

1

Texture guidance network for single image super resolution

Park, Hyoungwoo; Park, Sang Hyuk; Yoo, Chang-DongresearcherIEEE Signal Processing SocietyIEEE International Conference on Image Processing, 2017-09-18

2

Single Image Dehazing with Atrous Convolution and Fully Connected CRFs

Kim, Minsu; Yoo, Chang-DongresearcherIEEE Signal Processing SocietyIEEE International Conference on Image Processing, 2017-09-18

3

Partial person re-identification using Convolutional neural network and Attention model

Kim, JunYeong; Han, HouJeung; Yoo, Chang-DongresearcherIEEE Signal Processing SocietyIEEE International Conference on Image Processing, 2017-09-18

4

Saddlepoint methods for conditional expectations with applications to risk management

Kim, So Jung; Kim, Kyoung KukresearcherINT STATISTICAL INSTBERNOULLI, v.23, no.3, pp.1481 - 1517, 2017-08

5

Effect of active noise control and masking sound on speech intelligibility

Kim, Youngseok; Park, YoungjinresearcherELSEVIER SCI LTDAPPLIED ACOUSTICS, v.123, pp.152 - 157, 2017-08

6

Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; Kim, Hyesoo; Ha, Dongho; Bae, Michael; Kim, JounghoresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08

7

Simultaneous Generation of Microwave, Millimeter-Wave, and Terahertz Photonic Signal Based on Two-Color Semiconductor Laser Subject to Single-Beam Optical Injection

Wu, Jian-Wei; Qiu, Qi; Zhang, Xu-Ping; Won, Yong HyubresearcherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INCIEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, v.23, no.4, 2017-07

8

Toward a solar city: Trade-offs between on-site solar energy potential and vehicle energy consumption in San Francisco, California

Ko, Yekang; Jang, Kitaeresearcher; Radke, John D.TAYLOR & FRANCIS INCINTERNATIONAL JOURNAL OF SUSTAINABLE TRANSPORTATION, v.11, no.6, pp.460 - 470, 2017-07

9

Local universal lifting spaces of mod l Galois representations

Choi, Suh HyunresearcherACADEMIC PRESS INC ELSEVIER SCIENCEJOURNAL OF NUMBER THEORY, v.176, pp.113 - 148, 2017-07

10

A new s-adenosylhomocysteine hydrolase-linked method for adenosine detection based on DNA-templated fluorescent Cu/Ag nanoclusters

Ahn, Jun Ki; Kim, Hyo Yong; Baek, Songyi; Park, Hyun GyuresearcherELSEVIER ADVANCED TECHNOLOGYBIOSENSORS & BIOELECTRONICS, v.93, pp.330 - 334, 2017-07

11

A label-free fluorescent assay for deoxyribonuclease I activity based on DNA-templated silver nanocluster/graphene oxide nanocomposite

Lee, Chang Yeol; Park, Ki Soo; Jung, Yun Kyung; Park, Hyun GyuresearcherELSEVIER ADVANCED TECHNOLOGYBIOSENSORS & BIOELECTRONICS, v.93, pp.293 - 297, 2017-07

12

Reagentless colorimetric biosensing platform based on nanoceria within an agarose gel matrix

Kim, Do Hyun; Hur, Jaehyun; Park, Hyun Gyuresearcher; Kim, Moon IlELSEVIER ADVANCED TECHNOLOGYBIOSENSORS & BIOELECTRONICS, v.93, pp.226 - 233, 2017-07

13

User acceptance of media tablets: An empirical examination of perceived value

Yu, Jieun; Lee, Hwansoo; Ha, Imsook; Zo, HangjungresearcherELSEVIER SCIENCE BVTELEMATICS AND INFORMATICS, v.34, no.4, pp.206 - 223, 2017-07

14

Understanding makerspace continuance: A self-determination perspective

Han, Sang Yeal; Yoo, Jaeheung; Zo, Hangjungresearcher; Ciganek, Andrew P.ELSEVIER SCIENCE BVTELEMATICS AND INFORMATICS, v.34, no.4, pp.184 - 195, 2017-07

15

A Study on the Fine Pitch Flex-on-Flex (FOF) Assembly using Flux Added Nanofiber Solder Anisotropic Conductive Films (ACFs) and Thermo-compression Bonding Method

Lee, JiSoo; Kim, Jihye; Paik, Kyung-WookresearcherIEEE-CPMT2017 IEEE 67th Electronic Components and Technology Conference, 2017-06-01

16

Effect of Material Properties of Double Layer Non-Conductive Films (D-NCFs) on the Reflow Reliability of Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro Bump Interconnection

Lee, Seyong; Shin, JiWon; Paik, Kyung-WookresearcherIEEE-CPMT2017 IEEE 67th Electronic Components and Technology Conference, 2017-06-01

17

A Study on the Fabrication of Electrical Circuits on Fabrics using Cu Pattern Laminated B-stage Adhesive Films for Electronic Textile Applications

Jung, Seung-Yoon; Paik, Kyung-WookresearcherIEEE-CPMT2017 IEEE 67th Electronic Components and Technology Conference, Orlando, 2017-06-01

18

Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-in-Flex (CIF) Packages for Wearable Electronics Applications

Kim, Jihye; Lee, Tae-Ik; Yoon, Dal Jin; Kim, Taek-Sooresearcher; Paik, Kyung-WookIEEE-CPMT2017 IEEE 67th Electronic Components and Technology Conference, 2017-06-01

19

Effect of continuous hybrid process on mechanical and electrical properties of rectangular pure copper wire

Joo, Ho Seon; Hwang, Sun Kwang; Kim, Yong Nam; Im, Yong-TaekresearcherELSEVIER SCIENCE SAJOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.244, pp.51 - 61, 2017-06

20

Selective removal of heavy metal ions by disulfide linked polymer networks

Ko, Dongah; Lee, Joo Sung Jason; Patel, Hasmukh A.; Jakobsen, Mogens H.; Hwang, Yuhoon; Yavuz, Cafer T.researcher; Hansen, Hans Chr. Bruun; Andersen, Henrik R.ELSEVIER SCIENCE BVJOURNAL OF HAZARDOUS MATERIALS, v.332, pp.140 - 148, 2017-06

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