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Showing results 1 to 3 of 3

1
Multi-Stage Organic Logic Circuits Using Via-Hole-Less Metal Interconnects

Park, Hongkeun; Yoo, Hocheon; Lee, Chungryeol; Kim, Jae-Joon; Im, Sung Gap, IEEE ELECTRON DEVICE LETTERS, v.41, no.11, pp.1685 - 1687, 2020-11

2
Study on the Mechanism and Modeling for Super-filling of High-Aspect-Ratio Features with Copper by Catalyst Enhanced Chemical Vapor Deposition Coupled with Plasma Treatment

Kim, Chang-Gyu; Lee, Do-Seon; Lee, Won-Jong, KOREAN JOURNAL OF METALS AND MATERIALS, v.49, no.4, pp.334 - 341, 2011-04

3
Synthesis and photoluminescence of zinc sulfide nanowires by simple thermal chemical vapor deposition

Moon, Heesung; Nam, Changhun; Kim, Changwook; Kim, Bongsoo, MATERIALS RESEARCH BULLETIN, v.41, no.11, pp.2013 - 2017, 2006-11

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