Showing results 1 to 4 of 4
Methodology development of packaging substrate warpage analysis = 패키징 기판의 휨 분석 방법 개발link Kim, Cheol-Gyu; 김철규; et al, 한국과학기술원, 2014 |
On-Demand Tunable Electrical Conductance Anisotropy in a MOF-Polymer Composite Hong, Taegyun; Lee, Changjae; Bak, Yeongseo; Park, Geonhyeong; Lee, Hongju; Kang, Seunguk; Bae, Tae-Hyun; et al, SMALL, v.20, no.18, 2024-05 |
Preparation of structure-controlled nanocarbon-based conductive composite materials and their applications = 구조제어된 탄소나노소재 기반의 전도성 복합소재 제조 및 응용에 관한 연구link Kim, Mokwon; 김목원; et al, 한국과학기술원, 2014 |
Reliable joining of the spring wire to polymer composite for the micro-multi-functional actuator of cellular phones Kim, HS; Park, SW; Lee, Dai Gil, COMPOSITE STRUCTURES, v.76, no.3, pp.252 - 259, 2006-11 |
Discover