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Showing results 1 to 6 of 6

1
A Novel Interposer Channel Structure with Vertical Tabbed Vias to Reduce Far-End Crosstalk for Next-Generation High-Bandwidth Memory

Kim, Hyunwoong; Lee, Seonghi; Song, Kyunghwan; Shin, Yujun; Park, Dongyrul; Park, Jongcheol; Cho, Jaeyong; et al, MICROMACHINES, v.13, no.7, 2022-07

2
An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Choi, Sumin; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.927 - 939, 2017-06

3
Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure

Son, Kyungjune; Kim, Minsu; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.1, pp.100 - 110, 2022-01

4
Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network

Shin, Taein; Park, Shinyoung; Kim, Seongguk; Kim, Subin; Son, Kyungjune; Park, Hyunwook; Lho, Daehwan; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.7, pp.1122 - 1136, 2021-07

5
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module

Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09

6
Transformer Network-Based Reinforcement Learning Method for Power Distribution Network (PDN) Optimization of High Bandwidth Memory (HBM)

Park, Hyunwook; Kim, Minsu; Kim, Seongguk; Kim, Keunwoo; Kim, Haeyeon; Shin, Taein; Son, Keeyoung; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.70, no.11, pp.4772 - 4786, 2022-11

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