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Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03 |
The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints Kang S.K.; Lauro P.; Shin D.-Y.; Henderson D.W.; Bartelo J.; Gosselin T.; Cain S.R.; et al, MATERIALS TRANSACTIONS, v.45, no.3, pp.695 - 702, 2004 |
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