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Effects of Ag on the Kirkendall void formation of Sn-xAg/Cu solder joints Kim, Sung-Hwan; Yu, Jin, JOURNAL OF APPLIED PHYSICS, v.108, no.8, 2010-10 |
Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition Kang, SK; Leonard, D; Shih, DY; Gignac, L; Henderson, DW; Cho, S; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.479 - 485, 2006-03 |
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