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Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.534 - 543, 2009-02 |
Undercooling and microhardness of Pb-free solders on various under bump metallurgies Cho, Moon Gi; Kang, Sung K.; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.23, no.4, pp.1147 - 1154, 2008-04 |
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