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Showing results 58 to 79 of 79
| On the computation of the near-tip stress intensities for three-dimensional wedges via two-state M-integral Lee, Y; Im, Seyoung, JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, v.51, no.5, pp.825 - 850, 2003-05 |
| Optimization and reliability evaluation of COG bonding process Jeong, Young Hun; Jung, Seung-Won; Jin, Songwan; Kim, Kyung-Soo; Yun, Won-Soo, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.30, no.3, pp.1305 - 1313, 2016-03 |
| Peel strength improvement of foam core sandwich beams by epoxy resin impregnation on the foam surface Lee, CS; Lim, TS; Kwon, JW; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.5, pp.687 - 701, 2003 |
| Prediction of primary intermetallic compound formation during interfacial reaction between Sn-based solder and Ni substrate Choi, WK; Lee, HyuckMo, SCRIPTA MATERIALIA, v.46, no.11, pp.777 - 781, 2002-06 |
| PREDICTION OF RESIDUAL STRESS-INDUCED CRACKING BY FINITE-ELEMENT ANALYSIS KWEON, SY; Choi, Si-Kyung, SCRIPTA METALLURGICA ET MATERIALIA, v.32, no.3, pp.359 - 364, 1995-02 |
| Rupture time analyses of the Sn-3.5Ag solder alloys containing Cu or Bi Yu, Jin; Joo, DK; Shin, SW, ACTA MATERIALIA, v.50, no.17, pp.4315 - 4324, 2002-10 |
| Semi-active vibration control of space truss structures by friction damper for maximization of modal damping ratio Park, Young-min; Kim, Kwang-joon, JOURNAL OF SOUND AND VIBRATION, v.332, no.20, pp.4817 - 4828, 2013-09 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
| Sliding Mechanism of Lateral Thermosonic Process With Anisotropic Conductive Film for High Productivity and High Reliability Ha, Chang-Wan; Kim, Kyung-Rok; Kim, Kyung-Soo; Kim, Soohyun, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.2, pp.205 - 212, 2013-02 |
| Smart cure cycle for reducing the thermal residual stress of a co-cured E-glass/carbon/epoxy composite structure for a vanadium redox flow battery Nam, Soohyun; Lee, Dongyoung; Choi, Ilbeom; Lee, Dai-Gil, COMPOSITE STRUCTURES, v.120, pp.107 - 116, 2015-02 |
| Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, JOURNAL OF MATERIALS RESEARCH, v.19, no.8, pp.2428 - 2436, 2004-08 |
| Study on the effects of copper oxide growth on the peel strength of copper/polyimide Lee, Hyuek Jae; Yu, Jin, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.8, pp.1102 - 1110, 2008-08 |
| Surface modification of carbon fiber/epoxy composites with randomly oriented aramid fiber felt for adhesion strength enhancement Choi, Ilbeom; Lee, Dai Gil, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.48, pp.1 - 8, 2013-05 |
| The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
| Thermal diffusion barrier metallization based on Co-Mo powder-mixed composites for n-type skutterudite ((Mm,Sm)(y)Co4Sb12) thermoelectric devices Song, Jinseop; Kim, Yeongseon; Cho, Byung Jin; Yoo, Chung-Yul; Yoon, Hana; Park, Sang Hyun, JOURNAL OF ALLOYS AND COMPOUNDS, v.818, 2020-03 |
| Thermodynamic issues of lead-free soldering in electronic packaging Jeong, SW; Kim, JH; Lee, Hyuck-Mo, MATERIALS SCIENCE FORUM, v.426-4, pp.4081 - 4086, 2003 |
| Trenchless repairing of underground pipes using RTM based on the axiomatic design method Chin, WS; Kwon, JW; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.37, no.12, pp.1109 - 1126, 2003 |
| Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.50, no.9, pp.2291 - 2296, 2009-09 |
| Use of Time-Series Predictive Models for Piezoelectric Active-Sensing in Structural Health Monitoring Applications Figueiredo, Eloi; Park, Gyuhae; Farinholt, Kevin M.; Farrar, Charles R.; Lee, Jung-Ryul, JOURNAL OF VIBRATION AND ACOUSTICS-TRANSACTIONS OF THE ASME, v.134, no.4, 2012-08 |
| Using Intaglio-Shaped Bumps for Increasing the Conductive Particle Density in Lateral Thermosonic Process With Anisotropic Conductive Film Kim, Kyung Rok; Ha, Chang Wan; Kim, Kyung-Soo; Yun, Won-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.3, pp.371 - 376, 2014-03 |
| Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
| Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate Jung, In-Yu; Cho, Moon-Gi; Lee, Hyuck-Mo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2301 - 2307, 2009-11 |
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- 31,007 2020 - 2024
- 99,997 2010 - 2019
- 75,669 2000 - 2009
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- 62 1964 - 1969