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Showing results 3 to 5 of 5

3
Functionalized Bonding Materials and Interfaces for Heterogeneously Layer-Stacked Applications

Kim, Sanghyeon; Han, Jae-Hoon; Choi, Won Jun; Song, Jin Dong; Kim, Hyung-jun, JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.74, no.2, pp.82 - 87, 2019-01

4
Real-time 3D plane-wave imaging using annular capacitive micromachined ultrasonic transducer array

Kwon, Young Seok; Kim, Hae Youn; Kang, Dong-Hyun; Kim, Dong Hun; Jeong, Jae-Woong; Lee, Byung Chul, SENSORS AND ACTUATORS A-PHYSICAL, v.359, 2023-09

5
웨이퍼 접합 시험에서의 파괴역학적 응용 연구 = An application of fracture mechanics to wafer bonding testlink

문호정; Moon, Ho-Jeong; et al, 한국과학기술원, 1998

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