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| Flexural strength and dielectric properties of in-situ Si3N4-SiO2-BN composite ceramics Lee, Hyun Min; Lee, Seung Jun; Baek, Seungsu; Kim, Do-Kyung, JOURNAL OF THE KOREAN CERAMIC SOCIETY, v.51, no.5, pp.386 - 391, 2014-09 |
| Flexural stress and crack sensing capabilities of MWNT/cement composites Naeem, Faizan; Lee, Haeng-Ki; Kim, HK; Nam, IW, COMPOSITE STRUCTURES, v.175, pp.86 - 100, 2017-09 |
| Flickering Analysis of Erythrocyte Mechanical Properties: Dependence on Oxygenation Level, Cell Shape, and Hydration Level Yoon Y.-Z.; Hong H.; Brown A.; Dong C.K.; Dae J.K.; Lew V.L.; Cicuta P., BIOPHYSICAL JOURNAL, v.97, no.6, pp.1606 - 1615, 2009 |
| Fliessvermoegen und Warmrissverhalten von Blei-Antimon-Legierungen,Part I:Fliessvermoegen(Fluidity) S. Engler; Zin-Hyoung Lee, GIESSEREI, v.30, pp.107 - 116, 1978 |
| Fliessvermoegen und Warmrissverhalten von Blei-ANTIMON-Legierungen,Part II:Warmrissverhalten(Hot Tearing Behavior S. Engler; Zin-Hyoung Lee, GIESSEREI, v.30, pp.116 - 120, 1978 |
| Flight Dynamics and Navigation for Planetary Missions in Korea: Past Efforts, Recent Status, and Future Preparations Song, Young-Joo; Lee, Donghun; Bae, Jonghee; Kim, Young-Rok; Choi, Sun-Jin, JOURNAL OF ASTRONOMY AND SPACE SCIENCES, v.35, no.3, pp.119 - 131, 2018-09 |
| Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity 임명진; 김형준; 백경욱, 마이크로전자 및 패키징학회지, v.12, no.1, pp.9 - 16, 2005-03 |
| Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications Yim, MJ; Jeong, IH; Choi, HK; Hwang, JS; Ahn, JY; Kwon, W; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.28, pp.789 - 796, 2005-12 |
| Flip Chip on Organic Board Technology using Modified Anisotropic Conductive Films and Electroless Nickel/Gold Bump 백경욱; 임명진; 전영두, 한국마이크로전자 및 패키징학회지, v.6, no.2, pp.13 - 21, 1999-06 |
| Flip Chip 접속을 위한 무전해 니켈 범프의 형성 및 특성 연구 전영두; 임명진; 백경욱, 한국재료학회지, v.9, no.11, pp.1095 - 1101, 1999-11 |
| Flip-chip bonding of MEMS scanner for laser display using electroplated AuSn solder bump Chu, KM; Choi, WK; Ko, YC; Lee, JH; Park, HyoHoon; Jeon, DukYoung, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.1, pp.27 - 33, 2007-02 |
Floating axis wind turbines for offshore power generation-a conceptual study Akimoto, Hiromichi; Tanaka, Kenji; Uzawa, Kiyoshi, ENVIRONMENTAL RESEARCH LETTERS, v.6, no.4, pp.044017, 2011-11 |
| Floating Oscillator-Embedded Triboelectric Generator for Versatile Mechanical Energy Harvesting Seol, Myeong-Lok; Han, Jin-Woo; Jeon, Seung-Bae; Meyyappan, M.; Choi, Yang-Kyu, SCIENTIFIC REPORTS, v.5, 2015-11 |
| Floating phenomenon of layered basic zinc acetate structures on patterned silicon substrates: Aging and concentration effects Ahn, H. B.; Kim, Y. H.; Lee, JeongYong, MATERIALS LETTERS, v.75, pp.8 - 11, 2012-05 |
| Floating-ECC: Dynamic Repositioning of Error Correcting Code Bits for Extending the Lifetime of STT-RAM Caches Farbeh, Hamed; Kim, Hyeonggyu; Miremadi, Seyed Ghassem; Kim, Soontae, IEEE TRANSACTIONS ON COMPUTERS, v.65, no.12, pp.3661 - 3675, 2016-12 |
| Floating-patch MEMS antennas on HRS substrate for millimetre-wave applications Cho, YH; Ha, ML; Choi, W; Pyo, C; Kwon, Young Se, ELECTRONICS LETTERS, v.41, no.1, pp.5 - 6, 2005-01 |
| Flood Search Algorithm with MFDL Path in Circuit-Switched Networks Y.C.Park; S.C.Lee; C.K.Un, 한국통신학회논문지, v.18, no.3, pp.360 - 371, 1993-03 |
| Flooding correlation based on the concept of hyperbolicity breaking in a vertical annular flow No, Hee Cheon; Jeong, JH, NUCLEAR ENGINEERING AND DESIGN, v.166, no.2, pp.249 - 258, 1996-10 |
| Floor Response Spectra Analysis Including Correlations of Multiple Support Motions Yun, Chung-Bang; Hyun, Chang-Hun; Kong, Chung-Sik; Youn, Jae-Seog; 윤, 정방; 현, 창헌; 공, 정식; et al, 한국전산구조공학회학회지:전산구조공학, Vol.6, No.4, pp.67-72, 1993-12 |
| Floor Segmentation by Computing Plane Normals from Image Motion Fields for Visual Navigation Cui X.-N.; Kim Y.-G.; Kim H., INTERNATIONAL JOURNAL OF CONTROL AUTOMATION AND SYSTEMS, v.7, no.5, pp.788 - 798, 2009 |
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