| 79221 | Electromagnetically actuated MEMS switches for optical and RF communication systems = 전자기력으로 구동하는 광 스위치용 미소거울과 초고주파용 미소 기전 스위치link Cho, Il-Joo; 조일주; et al, 한국과학기술원, 2004 |
| 79222 | Electromagnetically actuated micromirror actuator and fabrication method thereof Cho, Il-Joo; Yun, Kwang-Seok; Yoon, Euisik |
| 79223 | Electromagnetically induced absorption spectra depending on intensities and detunings of the coupling field in Cs vapour m. kwon; h.d. park; h.s. moon; h.s. rawat; k. an; j.b. kim; Kim, Kyoungdae, JOURNAL OF PHYSICS B-ATOMIC MOLECULAR AND OPTICAL PHYSICS, v.34, no.23, pp.4801 - 4808, 2001-11 |
| 79224 | Electromagneto-thermo-mechanical behaviors of conductive circular plate subject to time-dependent magnetic fields Gao, Yuanwen; Xu, B; Huh, Hoon, ACTA MECHANICA, v.210, no.1-2, pp.99 - 116, 2010-02 |
| 79225 | Electromechanical diagnostic method for monitoring cracks in polymer electrolyte fuel cell electrodes Jang, Kyung-Lim; Kim, Sanwi; Jeong, Byeong-Heon; Oh, Jong-Gil; Hong, Bo Ki; Kim, Taek-Soo, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.42, no.16, pp.11644 - 11653, 2017-04 |
| 79226 | Electromechanical Enhancement of Metal Nanoparticle Thin Film by Composite Formation with Short Metal Nanowires Kim, Sanghyeok; Lee, Jaemin; Park, Jaeho; Lee, Jung-Yong; Kim, Jae-Hyun; Park, Inkyu, Functional Composites and Structures, v.1, no.3, 2019-09 |
| 79227 | Electromechanical impedance measurement from large structures using a dual piezoelectric transducer Sonh, Homin; Lim, Hyung Jin; Sohn, Hoon, JOURNAL OF SOUND AND VIBRATION, v.332, no.25, pp.6580 - 6595, 2013-12 |
| 79228 | Electromechanical impedance method of fiber-reinforced plastic adhesive joints in corrosive environment using a reusable piezoelectric device Na, Sam; Tawie, Rudy; Lee, Haeng-Ki, JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES, v.23, no.7, pp.737 - 747, 2012-05 |
| 79229 | Electromechanical Impedance-based Health Monitoring System for anchorage zone of tendon = 기전 임피던스 기반 긴장재 정착부 모니터링 시스템link Shim, Hyo-Jin; 심효진; et al, 한국과학기술원, 2012 |
| 79230 | Electromechanical method coupling non-invasive skin impedance probing and in vivo subcutaneous liquid microinjection: controlling the diffusion pattern of nanoparticles within living soft tissues Sung, Baeckkyoung; Kim, Se Hoon; Lee, Jin-Kyu; Lee, Byung Cheon; Soh, KS, BIOMEDICAL MICRODEVICES, v.16, no.4, pp.645 - 653, 2014-08 |
| 79231 | Electromechanical phenomena in non-centrosymmetric materials subject to strain gradients = 반전대칭이 깨진 물질에서 변형구배에 의한 전기기계 현상link Chu, Kanghyun; Yang, Chan-Ho; et al, 한국과학기술원, 2017 |
| 79232 | Electromechanical soft actuators based on Polystyrene-b-poly(1-alkyl-3-methylimidazolium p-styrenesulfonate) block copolymer = Polystyrene-b-poly(1-alkyl-3-methylimidazolium p-styrenesulfonate) 블록 공중합체에 기반한 전기-기계적 유연 액 츄에이터link Nguyen, Van Hiep; Oh, Il Kwon; et al, 한국과학기술원, 2018 |
| 79233 | Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, JW; Kim, JH; Paik, Kyung-Wook; Lee, HM, TMS 2004 133rd Annual Meeting & Exhibition, pp.294, 133rd TMS Annual Meeting, 2004-03 |
| 79234 | Electromigration in flip chip solder bump of 97Pb-3Sn/37Pb-63Sn combination structure Nah, JW; Kim, JH; Lee, HyuckMo; Paik, Kyung-Wook, ACTA MATERIALIA, v.52, no.1, pp.129 - 136, 2004-01 |
| 79235 | Electromigration in Flip Chip Solder Bump of 97Pb-3Sn/37Pb-63Sn Combination Structure Nah, Jae-Woong; Kim, Jong Hoon; Lee, Hyuck-Mo; Paik, Kyung-Wook, 133rd TMS Annual Meeting, 133rd TMS Annual Meeting, 2004-03 |
| 79236 | Electromigration induced Kirkendall void growth in Sn-3.5Ag/Cu solder joints Jung, Yong; Yu, Jin, JOURNAL OF APPLIED PHYSICS, v.115, no.8, 2014-02 |
| 79237 | Electromigration model for the prediction of lifetime based on the failure unit statistics in aluminum metallization Park, JH; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.93, no.2, pp.883 - 892, 2003-01 |
| 79238 | Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, International Conference on Electronic Materials and Packaging, EMAP 2006, 123, 2006-12-11 |
| 79239 | Electromigration of Pb-free solder flip chip using electroless Ni-P/Au UBM Kwon, YM; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference, ECTC '07, pp.1472 - 1477, IEEE, 2007-05-29 |
| 79240 | Electromigration Performance of Pb-free Solder Joints in Terms of Solder Composition and Joining Path Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Lee, HyuckMo, JOM, v.62, no.7, pp.22 - 29, 2010-07 |
