| 76401 | EFFECTS OF SUBSTRATE AND BOTTOM ELECTRODES ON THE PHASE-FORMATION OF LEAD-ZIRCONATE-TITANATE THIN-FILMS PREPARED BY THE SOL-GEL METHOD Kim, C; Yoon, D; Lee, J; Choi, C; No, Kwangsoo, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.33, no.5A, pp.2675 - 2678, 1994-05 |
| 76402 | Effects of substrate bias on electron energy distribution in magnetron sputtering system Seo, Sang-Hun; In, Jung-Hwan; Chang, Hong-Young; Han, Jeon-Geon, PHYSICS OF PLASMAS, v.11, no.10, pp.4796 - 4800, 2004-10 |
| 76403 | Effects of substrate bias voltage on plasma parameters in temperature control using a grid system Bai, KH; Hong, JI; You, SJ; Chang, Hong-Young, PHYSICS OF PLASMAS, v.8, no.9, pp.4246 - 4250, 2001-09 |
| 76404 | Effects of Substrate Bias Voltage on Properties of CoCrPt/Cr media Lee, Taek Dong, THIN SOLID FILMS, v.3, no.341, pp.31 - 36, 1999-01 |
| 76405 | Effects of substrate conductivity on convective cooling of electronic components Choi, C.Y.; Kim, SungJin; Ortega, A., JOURNAL OF ELECTRONIC PACKAGING, v.116, no.3, pp.198 - 205, 1994-09 |
| 76406 | Effects of Substrate Conductivity on Convective Cooling of Electronic Components Kim, SungJin; Choi, C.; Ortega, A., International Symposium on Transport Phenomena, pp.1218 - 1224, 1993 |
| 76407 | Effects of substrate misorientation on the formation and characteristics of self-assembled InP/InGaP quantum dots Kwon, YH; Cho, Yong-Hoon; Choe, BD; Park, SK; Jeong, WG, JAPANESE JOURNAL OF APPLIED PHYSICS, v.37, no.4A, pp.366 - 368, 1998-04 |
| 76408 | Effects of substrate morphology and ageing on cycle performance of a Sn-anode fabricated by electroplating Park, JW; Rajendran, S; Kwon, Hyuk-Sang, JOURNAL OF POWER SOURCES, v.159, pp.1409 - 1415, 2006-09 |
| 76409 | Effects of Substrate Morphology and Postelectrodeposition on Structure of Cu Foam and Their Application for Li-Ion Batteries Kim, Ryoung-Hee; Han, Dong-Wook; Nam, Do-Hwan; Kim, Jeong-Han; Kwon, Hyuk-Sang, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.157, no.5, pp.269 - 273, 2010 |
| 76410 | Effects of Substrate Morphology on Adhesion and Pore Structure of Cu foam Prepared by Electrodeposition Kim, Ryung Hee; Han, Dong Wook; Nam, Do Hwan; Kim, Jeong Han; Kwon Hyuk-Sang, 2009 International Conference on Nano Science and Nano Technology, Gwangju-Jeonnam Nano Science and Technology Union, 2009-11 |
| 76411 | Effects of substrate network topologies on competition dynamics Lee, SH; Jeong, Hawoong, PHYSICAL REVIEW E, v.74, pp.643 - 645, 2006-08 |
| 76412 | Effects of substrate orientation on formation and characteristics of self-assembeld InP/InGaP quantum dot lasers Kwon, YH; Cho, Yong-Hoon; Choe, BD; Park, SK; Jeong, WG; Choo, AG; Kim, TI, Optoelectronics and Communications Conference (OECC) ’97 Technical Digest, pp.470 -, 1997 |
| 76413 | Effects of substrate stiffness and mechanical stimulus on cell motility = 표면 강성 및 기계적 자극이 세포의 운동성에 미치는 영향link Lee, Woo-Taek; 이우택; et al, 한국과학기술원, 2010 |
| 76414 | Effects of substrate stiffness on cell morphology and motility 이우택; 송석현; 오지우; 남아현; 신현정, 대한기계학회 2009년도 추계학술대회, 대한기계학회, 2009-11 |
| 76415 | Effects of subsurface damage layer on flexural properties and reliability of thinned silicon wafers = 연마된 표면 아래의 손상층이 얇은 실리콘 웨이퍼의 굽힘 물성 및 신뢰성에 미치는 영향link Gu, Chang-Yeon; Kim, Taek-Soo; et al, 한국과학기술원, 2023 |
| 76416 | Effects of sulfate and nitrate ion additives on pit growth of pure aluminum in 0.1 M sodium chloride solution Pyun, Su Il; Na, KH; Lee, WJ; Park, JJ, CORROSION, v.56, no.10, pp.1015 - 1021, 2000-10 |
| 76417 | Effects of sulfate on microbial community structures and organic fatty acid utilization in acclimated anaerobic sludges = 순응된 혐기성 슬러지의 미생물 군집과 유기산 이용특성에 황산염이 미치는 영향의 연구link Kim, Guen-Bae; 김근배; et al, 한국과학기술원, 2005 |
| 76418 | Effects of Sulfidation of Mo Nitride and CoMo Nitride Catalysts on Thiophene HDS Ihm, Son Ki, Catalyst Deactivation 97, 1997 |
| 76419 | Effects of sulfidation of Mo nitride and CoMo nitride catalysts on thiophene HDS Ihm, Son Ki; Kim, DW; Lee, DK, CATALYST DEACTIVATION 1997 Book Series: STUDIES IN SURFACE SCIENCE AND CATALYSIS, v.111, pp.343 - 350, 1997 |
| 76420 | Effects of sulfide-forming element additions on the Kirkendall void formation and drop impact reliability of Cu/Sn-3.5Ag solder joints Kim, J. Y.; Yu, Jin; Kim, Sung-Hwan, ACTA MATERIALIA, v.57, pp.5001 - 5012, 2009-10 |
